Multi-Chip Package Channel Driving for Stacked Signal Integrity

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Solution Overview

Problem

In multi-chip systems, the increasing number of stacked chips leads to variations in signal characteristics due to increased channel length and loading, which can result in signal distortion and reduced high-speed transmission efficiency.

Innovation Solution

The drivability of transmission circuits is adjusted based on the number of chips sharing a channel, using mechanisms such as chip number storage units and activation control units to optimize signal transmission by varying the number of transmission circuits and TSVs, ensuring stable signal transmission regardless of the number of chips.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the number of stacked chips is increased to improve memory capacity and integration degree, then memory capacity and integration are improved, but signal characteristics on the shared channel deteriorate due to increased channel length and loading

Engineering Contradiction:
Improvememory capacityVSAvoidsignal characteristics
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent applies dynamics by making the transmission circuit configuration adjustable based on the number of stacked chips. The system dynamically selects different numbers of transmission circuits and TSVs according to the actual chip stack configuration, transforming a static design into an adaptive one that optimizes signal transmission for each specific scenario.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes physical parameters of the transmission system by varying the number of transmission circuits and TSVs based on the number of stacked chips. This parameter adjustment compensates for the deteriorating signal characteristics caused by increased channel length and loading, maintaining signal integrity across different memory capacities.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the number of transmission circuits is increased to improve signal transmission capability, then transmission capability is improved, but device complexity and power consumption increase

Engineering Contradiction:
Improvesignal transmission capabilityVSAvoidtransmission circuit configuration
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent adjusts the number of transmission circuits as a variable parameter based on the number of stacked chips. Instead of using a fixed large number of transmission circuits in all configurations, the system optimizes the transmission circuit count to match the actual signal transmission needs, reducing unnecessary complexity and power consumption.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If the number of TSVs is increased to improve data bandwidth, then data bandwidth is improved, but manufacturing complexity and cost increase

Engineering Contradiction:
Improvedata bandwidthVSAvoidTSV fabrication
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The patent makes the number of TSVs a variable parameter that adapts to the number of stacked chips. This approach allows the system to achieve sufficient data bandwidth for each configuration without unnecessarily increasing TSV count, thereby reducing manufacturing complexity and cost while maintaining adequate productivity.

Inventive Principle:
Principle #35Parameter changes

4Quantity of substance

If the channel length is increased to accommodate more stacked chips, then memory capacity is improved, but signal distortion increases and transmission speed decreases

Engineering Contradiction:
Improvememory capacityVSAvoidtransmission speed
Core Design Contradiction:
Quantity of substanceVSSpeed

Solution Approach 1:

The patent applies dynamics by adjusting the transmission circuit configuration in response to the increased channel length. As more chips are stacked and channel length increases, the system dynamically modifies the number of transmission circuits and TSVs to compensate for signal degradation, maintaining transmission speed despite longer channels.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes transmission parameters by varying the number of transmission circuits and TSVs based on channel length. This parameter adjustment compensates for the increased signal distortion and reduced transmission speed caused by longer channels in multi-chip configurations.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS8854088B2Multi-chip system and semiconductor package
Publication Date: 2014.10.07 SK HYNIX INC
  • US8854088B2 patent drawing
  • US8854088B2 patent drawing
  • US8854088B2 patent drawing

AI summary

A multi-chip system may include a plurality of chips, and a channel shared by the plurality of chips. At least one of the plurality of chips includes a transmission circuit configured to transmit a signal to the channel. Drivability of the transmission circuit is adjusted based on a number of the plurality of chips.