Multi-Chip Module Clamp Architecture for Warp-Resistant Cooling
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Solution Overview
Problem
Multi-chip modules with Integrated Fan Out (InFO) substrates face challenges such as temperature-induced warping and heat removal difficulties due to differing expansion characteristics, which can damage the substrate and hinder efficient cooling.
Innovation Solution
A multi-chip module design featuring a Redistribution Layer (RDL) substrate with a modular direct-clamp structure that mounts IC dies on opposite sides of the InFO substrate, using socket frames, screws, and a cold plate for thermal management, ensuring mechanical stability and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an InFO substrate is used to provide signal connectivity between IC dies, then signal connectivity efficiency is improved, but the substrate is prone to warping, stretching, shrinking or damage due to temperature-based expansion differences
Solution Approach 1:
The substrate structure is segmented into multiple functional layers including the InFO substrate layer, a stress compensation layer, and a mounting structure with distributed mounting points. This segmentation allows each layer to independently manage its function while collectively maintaining substrate stability against thermal expansion forces.
Solution Approach 2:
The patent modifies the physical and mechanical parameters of the substrate assembly by introducing a stress compensation layer with specific material properties and thickness, and by designing a mounting structure with optimized geometry and distribution. These parameter changes enable the assembly to accommodate thermal expansion without compromising the InFO substrate's integrity or signal connectivity performance.
2Reliability
If the InFO substrate is used in multi-chip modules, then signal connectivity is enhanced, but heat removal becomes difficult
Solution Approach 1:
The patent introduces a thermal interface material and a dedicated heat dissipation structure as intermediary elements between the IC dies and the cooling system. These intermediaries facilitate efficient heat transfer from the high-power IC dies through the InFO substrate assembly, addressing the heat removal challenge while preserving the substrate's signal connectivity function.
Solution Approach 2:
The patent adds a vertical dimension to heat dissipation by implementing a three-dimensional thermal management architecture with multiple heat dissipation paths. This includes thermal vias through the substrate, heat spreaders, and external cooling components, transforming the heat removal problem from a two-dimensional surface issue to a three-dimensional volumetric solution that enhances thermal efficiency without compromising the InFO substrate's planar signal connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable mounting system that prevents substrate damage from thermal expansion and enhances heat removal capabilities, ensuring reliable operation of high-power multi-chip modules.
Implementation Method 1
a cold plate mounted to the first plurality of IC dies
Implementation Method 2
a plurality of screws extending from the plurality of socket frames through the plurality of holes formed through the RDL substrate and screwed into the cold plate
Data Source
AI summary
Described is a multi-chip module that may include a Redistribution Layer (RDL) substrate having Integrated Circuit (IC) dies mounted to a first surface of the RDL substrate. A second plurality of IC dies may be mounted to an opposite second surface. A plurality of sockets can be mounted upon the second plurality of IC dies and a cold plate then mounted to the first plurality of IC dies. The mounting structure may include socket frames coupled to the plurality of sockets.