Multi-Chip Package Direct Bonding for Better Thermal Conduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving high-performance and compact designs due to the limitations of traditional bump-based connections, which hinder thermal conductivity and integration efficiency.
Innovation Solution
The development of a packaged semiconductor device that connects multiple semiconductor chips via direct bonding without bumps, utilizing a structure with bond pads and insulation layers to enhance thermal conductivity and integration, allowing for smaller bond pads and improved speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional bump-based connections are used to connect semiconductor chips, then the connection structure is established, but thermal conductivity is reduced and integration efficiency is hindered
Solution Approach 1:
The patent removes the bump structure from the chip connection system, extracting the problematic element that hindered thermal conductivity. By eliminating bumps and using direct bond pad contact, the connection structure is simplified while improving thermal performance.
Solution Approach 2:
The patent introduces bond insulation layers as intermediaries between bond pads to enable direct bonding while maintaining electrical isolation. This mediator allows chips to be connected directly without bumps, improving thermal conductivity while preserving electrical functionality.
2Temperature
If polymer layers are used in the connection structure, then the chips are connected, but thermal conductivity is reduced due to low thermal conductivity of polymer materials
Solution Approach 1:
The patent changes the material parameter of the insulation layer from polymer to inorganic material. This parameter change dramatically improves thermal conductivity while the manufacturing process remains feasible through standard semiconductor fabrication techniques.
3Reliability
If larger bond pads are used to ensure reliable connection, then connection reliability is improved, but the package area increases and compactness is reduced
Solution Approach 1:
The patent uses composite material structures including inorganic insulation layers and metal bond pads with specific configurations. This composite approach enables smaller bond pad areas while maintaining reliable connections through improved material properties and structural design.
4Area of stationary object
If multiple semiconductor chips are stacked vertically to reduce layout area, then compactness is improved, but thermal management becomes more challenging
Solution Approach 1:
The patent removes polymer layers and bump structures that impeded thermal conduction, extracting thermal resistance from the vertical stack. This enables efficient heat dissipation in multi-chip vertical configurations, allowing compact packaging without compromising thermal management.
Data Source
AI summary
A semiconductor package includes a first connection structure, a first semiconductor chip on an upper surface of the first connection structure, a first molding layer on the upper surface of the first connection structure and surrounding the first semiconductor chip, a first bond pad on the first semiconductor chip, a first bond insulation layer on the first semiconductor chip and the first molding layer and surrounding the first bond pad, a second bond pad directly contacting the first bond pad, a second bond insulation layer surrounding the second bond pad; and a second semiconductor chip on the second bond pad and the second bond insulation layer.