Thin Multichip Flex-Module with Compliant Layer for Low Insertion Force
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Solution Overview
Problem
Current multichip module technology is expensive due to low volume custom applications, lacking high-volume, industry-standard solutions for 'known good die' and being unsuitable for cost-driven memory module production, which limits its adoption in mass market products like SIMM and DIMM memory modules.
Innovation Solution
A low insertion force multichip in-line module design featuring a rigid frame, flex circuit with integrated IC chips, and a compliant layer for enhanced electrical continuity, along with a foldable frame for improved thermal management and cooling, allowing for higher density and cost-effective manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If multichip module technology is used to improve system performance and packaging density, then chip-to-chip communication distance is shortened and operating speeds increase, but manufacturing cost increases due to low volume custom applications
Solution Approach 1:
The patent applies universality by designing a standardized multichip module that can be used across multiple applications and platforms. The module uses industry-standard packaging and mounting techniques that can be manufactured using existing high-volume production lines, eliminating the need for custom low-volume manufacturing processes while maintaining high performance characteristics
Solution Approach 2:
The patent segments the system by placing multiple independent IC chips on a single substrate rather than using one large custom chip. This allows each chip to be manufactured separately using standard processes, then assembled into a high-performance module using automated pick-and-place technology, achieving both high speed and cost efficiency
2Volume of moving object
If multichip module technology is used to achieve higher packaging density, then miniaturization is accomplished, but manufacturing cost increases due to lack of high-volume production capability
Solution Approach 1:
The patent transitions from two-dimensional PCB mounting to three-dimensional chip stacking and arrangement on the substrate. Multiple IC chips are positioned in vertical and horizontal arrangements that maximize space utilization, achieving high packaging density while using standard manufacturing processes that can scale to high volumes
Solution Approach 2:
The patent uses a flexible substrate that can be bent and folded to accommodate multiple IC chips in a compact form factor. This flexible mounting approach allows high-density packaging while using standard flexible circuit board manufacturing processes that support high-volume production
3Strength
If rigid frame structure is used to provide structural support, then mechanical strength is improved, but thermal management capability deteriorates
Solution Approach 1:
The patent employs a composite structure combining rigid frame materials with thermally conductive materials. The frame provides mechanical strength while integrated heat sinks and thermal vias conduct heat away from the IC chips, achieving both structural integrity and effective thermal management through material composition rather than单一的 rigid structure
Data Source
AI summary
A low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins. Alternatively, a low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; a socket configured to matably engage the module; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins.