Multichip Flex-Module Socket Assembly for High-Density Memory
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Solution Overview
Problem
Current multichip module technology is expensive due to low volume, custom applications, and lacks reliable high-volume sources for 'known good die,' making it unsuitable for mass market memory modules like SIMM and DIMM, which require higher performance and lower costs.
Innovation Solution
A socket assembly for multichip in-line modules with a rigid housing, parallel sockets, and internal connections for efficient signal transfer, combined with a flexible circuit and heat sink for optimal thermal management, allowing for higher density and active cooling, while being backward-compatible with industry standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If multichip module technology is used to improve system performance and packaging density, then chip-to-chip communication distance is shortened and operating speeds increase, but manufacturing cost increases due to low volume custom applications
Solution Approach 1:
The patent applies universality by designing a multichip module that can be manufactured using standard memory module assembly processes and equipment. The module uses conventional PCB substrates, surface mount technology, and industry-standard testing procedures, allowing it to leverage existing manufacturing infrastructure rather than requiring custom low-volume production lines. This enables high-volume manufacturing capability while maintaining the performance benefits of multichip architecture.
2Productivity
If standard memory module assembly processes are used to reduce manufacturing cost, then production volume can be increased, but packaging density and performance are limited
Solution Approach 1:
The patent employs dimensionality change by transitioning from traditional two-dimensional surface mounting of chips on PCB to a three-dimensional stacked multichip configuration. Multiple memory chips are vertically stacked and interconnected through through-substrate vias and interlayer connectors, enabling significantly higher packaging density within the same footprint while still using standard PCB assembly processes and surface mount technology.
3Quantity of substance
If high-density multichip configuration is implemented to improve packaging density, then component density increases, but thermal management becomes more difficult
Solution Approach 1:
The patent introduces thermal management intermediaries including thermally conductive adhesive layers between chips and substrate, heat sink structures attached to the PCB, and thermally conductive filler materials in the encapsulant. These intermediary thermal pathways efficiently conduct heat away from the densely packed chips, preventing thermal accumulation while maintaining the high component density configuration.
4Speed
If custom multichip module design is used to achieve high performance, then operating speed increases, but reliability decreases due to lack of standardized testing and assembly procedures
Solution Approach 1:
The patent changes the manufacturing parameters from custom multichip module processes to standardized memory module assembly parameters. It uses conventional surface mount technology solder reflow profiles, industry-standard electrical testing procedures, and established reliability qualification protocols. This standardization maintains high operating speeds through optimized chip stacking while significantly improving assembly yield and reliability through proven manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables lower-cost, higher-density memory modules with improved thermal cooling and rework capability, suitable for high-end computing applications, and compatible with existing connectors, addressing the cost and performance limitations of traditional modules.
Implementation Method 1
flexible circuit and heat sink for optimal thermal management
Implementation Method 2
active cooling
Data Source
AI summary
A socket assembly for multichip in-line modules comprises: at least three parallel in-line sockets, one of which is an edge-card socket adapted to matably engage electrodes on the edge of a printed circuit board, and the others of which are module sockets adapted to accept multichip in-line modules; and, internal connections between respective pins in each of the parallel sockets, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules. Alternatively, a socket assembly for multichip in-line modules comprises: a substantially rigid housing structure; at least two parallel in-line sockets adapted to accept multichip in-line modules; a set of electrodes adapted for soldering to a printed circuit board; and, internal connections between respective pins in each of the parallel sockets and the set of electrodes, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules.