Multichip LED Package with Diagonal Symmetry
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Solution Overview
Problem
Traditional lighting devices such as incandescent and fluorescent bulbs have limitations including quick attenuation, high power consumption, high heat generation, short service life, and fragility, necessitating the development of high-powered LED illuminating devices that can provide a symmetrical and uniform light-blending source.
Innovation Solution
A multichip package structure comprising a substrate unit with diagonally disposed and electrically connected light-emitting elements, surrounded by conductive frames and covered by light-transmitting package bodies, which generates a symmetrical and uniform light-blending source through the use of bridging conductive layers and insulative frames.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional lighting devices (incandescent bulbs, fluorescent bulbs) are used, then they provide sufficient illumination, but they have quick attenuation, high power consumption, high heat generation, short service life, and high fragility
Solution Approach 1:
The patent transitions from traditional lighting parameters (incandescent/fluorescent) to LED technology with different operational characteristics, achieving lower power consumption and longer service life through fundamental parameter changes in the light source technology
Solution Approach 2:
The patent uses a composite structure combining multiple LED chips (first and second light-emitting elements) with different chromaticity characteristics on a substrate, creating a unified lighting system that achieves both energy efficiency and reliable color consistency over time
2Illumination intensity
If multiple LED elements are arranged to improve light uniformity, then light-blending source symmetry is achieved, but device complexity increases
Solution Approach 1:
The patent employs symmetrical arrangement of LED elements (diagonally disposed first and second light-emitting elements) to achieve uniform light output, using symmetry as a design principle to simplify the path to light uniformity rather than requiring complex asymmetric adjustments
Solution Approach 2:
The patent divides the lighting system into segmented LED chips mounted on a substrate, with each chip contributing to the overall uniform light output, allowing independent optimization of each segment while achieving collective uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multichip package structure effectively produces a symmetrical and uniform light-blending source by transforming blue light into white light, offering improved durability and energy efficiency compared to traditional lighting solutions.
Implementation Method 1
at least two first light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body and at least two second light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body
Implementation Method 2
The first LED element is sealed by a first resin having a first phosphor included, and the second LED element is sealed by a second resin having a second phosphor included
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
A multichip package structure (Z) for generating a symmetrical and uniform light-blending source includes a substrate unit (1), a light-emitting unit (2) and a package unit (4). The substrate unit (1) includes a substrate body (10) and at least one bridging conductive layer (11) disposed on the top surface of the substrate body (10). The light-emitting unit (2) includes at least two first light-emitting elements (21) diagonally disposed on the substrate body (10) and electrically connected to the substrate body (10) and at least two second light-emitting elements (22) diagonally disposed on the substrate body (10) and electrically connected to the substrate body (10). The package unit (4) includes at least two first light-transmitting package bodies (41) respectively covering the at least two first light-emitting elements (21) and at least two second light-transmitting package bodies (42) respectively covering the at least two second light-emitting elements (22).