Miniaturized Multi-Chip Module With Interposer
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Solution Overview
Problem
Conventional multi-chip modules for wireless transmission devices face limitations in miniaturization due to the number of external electrical connections, susceptibility to thermal and compression stresses, and high capital costs associated with ball-planting equipment.
Innovation Solution
A miniaturized multi-chip module design incorporating an interposer with conductors and a substrate that allows for increased electrical connections without increasing module size, using a printed circuit board material and surface mount technology to reduce interference and deformation risks, eliminating the need for expensive ball-planting machines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If solder balls are used for external electrical connections in a conventional multi-chip module, then the module can be mounted on a circuit board, but the number of external electrical connections is limited and the module size increases
Solution Approach 1:
The patent transitions from using solder balls (three-dimensional protruding elements requiring horizontal spacing) to using solder pads (two-dimensional planar elements). This dimensional change allows electrical connections to be arranged in a compact grid pattern on the substrate surface, significantly increasing the number of connections within the same module area.
Solution Approach 2:
The invention extracts the spherical solder ball component and replaces it with planar solder pads integrated directly into the substrate surface. This elimination of the ball structure removes the need for horizontal clearance between connections, enabling higher connection density without increasing module dimensions.
2Reliability
If solder balls are used to provide external electrical connections, then electrical connectivity is achieved, but the solder balls are susceptible to thermal and compression stresses causing deformation and short-circuiting
Solution Approach 1:
Instead of using three-dimensional solder balls that are prone to deformation, the patent creates a two-dimensional copy of the connection interface through solder pads. These pads maintain electrical connectivity while being inherently more resistant to thermal and compression stresses, as they lack the protruding spherical structure that deforms under stress.
Solution Approach 2:
The solder pads are integrated directly into the substrate as a permanent, stress-resistant structure rather than using separate solder ball components. This integrated approach creates a more durable connection that withstands thermal cycling and compression without the deformation issues that plague discrete solder ball assemblies.
3Extent of automation
If ball-planting machines are used to plant solder balls onto the module substrate, then automated assembly is achieved, but the capital cost of manufacturing equipment increases
Solution Approach 1:
The invention removes the solder ball planting step entirely from the manufacturing process. By replacing solder balls with solder pads that are pre-formed on the substrate, the complex and expensive ball-planting machinery is eliminated, simplifying the manufacturing process and reducing capital equipment costs while maintaining automated assembly capabilities.
Data Source
AI summary
A miniaturized multi-chip module suitable for application to wireless transmission devices includes a substrate, integrated circuit chips mounted on and connected electrically to the substrate, and an interposer mounted on one surface of the substrate. The interposer cooperates with the substrate to confine a receiving space for receiving the integrated circuit chips on the surface of the substrate to which the interposer is attached, and is provided with conductors that are connected electrically to the substrate. Therefore, when the interposer is mounted on a circuit board, the conductors serve as external electrical connections for the integrated circuit chips. A method for manufacturing the miniaturized multi-chip module is also disclosed.