Cooled Multichip Module Thermal Via Inversion
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Solution Overview
Problem
Conventional microchip cooling methods in ceramic modules, which dissipate heat through the carrier board, result in complex production processes and reduced flexibility due to rear-side cooling requirements, leading to insufficient heat dissipation and reduced component lifespan.
Innovation Solution
An electronic circuit arrangement featuring a heat-radiating component mounted on the underside of a multi-layer substrate with thermal vias connecting it to the top side, allowing for efficient cooling without needing components on the carrier board's back, thus enabling compact design and increased flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is dissipated through the back of the carrier board, then the microchip can be cooled, but the production process becomes significantly more complex and flexibility is restricted
Solution Approach 1:
Instead of cooling the microchip from the back of the carrier board as in conventional designs, this patent inverts the approach by mounting the heat-radiating component on the underside of the multi-layer substrate and conducting heat through thermal vias to the top side, where the heat sink is located. This eliminates the need for rear-side cooling components and associated complex production processes.
2Temperature
If heat is dissipated through the back of the carrier board, then cooling is achieved, but the heat dissipation efficiency is insufficient for high-power applications
Solution Approach 1:
The patent extracts the heat conduction path from the conventional back-cooling approach and creates a dedicated, direct thermal pathway through the substrate using thermal vias. This separates the heat dissipation function from the mechanical support function, allowing optimized thermal management independent of the carrier board's structural requirements.
Solution Approach 2:
The patent transitions from two-dimensional heat dissipation (through the thin carrier board) to three-dimensional heat management by utilizing vertical thermal vias through the multi-layer substrate. This adds a vertical dimension to heat conduction, creating a direct path from the heat source through multiple substrate layers to the heat sink, significantly improving thermal efficiency.
3Temperature
If components are mounted on the back of the carrier board for cooling, then heat dissipation is achieved, but space requirements increase and flexibility is reduced
Solution Approach 1:
The patent merges the heat sink with the top side of the multi-layer substrate, eliminating the need for separate rear-side cooling components. The heat-radiating component mounted on the underside works in direct thermal conjunction with the heat sink on the top side, consolidating the cooling system within the substrate structure itself and reducing overall space requirements.
4Device complexity
If conventional back-side cooling is used, then simple structure is maintained, but component lifespan is reduced due to overheating
Solution Approach 1:
The patent introduces thermal vias as intermediary elements that mediate heat transfer between the heat-radiating component on the underside and the heat sink on the top side. These vias act as thermal conduits embedded within the substrate, providing efficient heat evacuation while maintaining structural integrity and simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides effective cooling with a short thermal path, reduces space requirements, and enhances flexibility in device installation while maintaining reliable thermal and electrical connections, improving the lifespan and performance of microchips.
Implementation Method 1
The heat-radiating component is connected to the top side of the multi-layer substrate by means of the at least one thermal via. The heat-radiating component is cooled by the at least one thermal through-connection through the multi-layer substrate.
Data Source
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AI summary
The arrangement has a heat radiating component i.e. microchip (10), connected with a lower side of a multi-layered substrate (47) e.g. ceramic substrate, and with an upper side of the substrate by a thermal feedthrough (44). The component is cooled by the substrate using the feedthrough by a cooling element e.g. heat sink. A surface mounted device (13) is mounted on the upper side of the substrate. The feedthrough is connected to the cooling element by a distance piece. A ball grid array or a land grid array is arranged on a lower side of the arrangement.