Multichip packages formed in stable struture and method of forming the same
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Solution Overview
Problem
Existing multichip packages face challenges in maintaining structural stability and heat dissipation due to overhangs caused by offset stacking of chips, leading to physical deformation and inefficient heat management.
Innovation Solution
A multichip package design that includes a substrate connected to solder balls, with stacked chips supported by a support structure that provides external electrical connections and heat dissipation through highly conductive materials, reducing overhang-induced deformation and enhancing thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chips are offset stacked to increase integration and interconnectivity, then device performance and cost efficiency are improved, but structural stability deteriorates due to overhang-induced physical deformation
Solution Approach 1:
The support structure is divided into a body portion and an extended portion, where the body portion is stacked on the substrate and the extended portion supports the overhang. This segmentation allows the support structure to independently handle different functional requirements: electrical connection through the body and mechanical support through the extension.
Solution Approach 2:
The support structure acts as an intermediary element between the substrate and the overhanging chip portion. It provides both mechanical support to prevent deformation and electrical connection pathways, mediating between the conflicting requirements of structural integrity and electrical functionality.
2Productivity
If chips are offset stacked to increase integration, then integration density is improved, but heat dissipation efficiency deteriorates due to overhangs
Solution Approach 1:
The support structure serves as a thermal intermediary, conducting heat away from the overhanging chip portion through its extended region. This intermediary structure provides a dedicated heat dissipation pathway that does not interfere with the electrical connection function.
Solution Approach 2:
The support structure's body and extended portions are segmented to perform different thermal management functions. The extended portion specifically addresses heat dissipation from the overhang region, while the body portion maintains electrical connections to the substrate.
3Stability of the object's composition
If a support structure is added to stabilize overhangs, then structural stability is improved, but device complexity increases
Solution Approach 1:
The support structure is designed to perform multiple functions simultaneously: providing mechanical support to prevent overhang deformation, establishing electrical connections between chips and substrate, and facilitating heat dissipation. This multi-functionality reduces the need for separate components.
Solution Approach 2:
The support structure merges the mechanical support function and electrical connection function into a single integrated component. The body portion and extended portion are combined to achieve both structural stability and electrical connectivity without requiring separate support and connection elements.
4Reliability
If multiple solder balls are used for external electrical connections, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
Each solder ball is designed to serve multiple purposes: providing electrical connection pathways and serving as anchoring points for the support structure body. This multi-functionality maintains high electrical connectivity while simplifying the manufacturing process by reducing the number of separate components needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design stabilizes the multichip package structure by supporting overhangs and effectively dissipates heat, ensuring improved performance and reliability by preventing physical deformation and optimizing thermal management.
Implementation Method 1
heat dissipation through highly conductive materials
Data Source
AI summary
A multichip package includes a substrate connected to a plurality of solder balls including a first solder ball, a first chip stacked over or on the substrate, a second chip stacked over or on the first chip and including a first overhang not supported by the first chip, and a support structure supporting the first overhang and connected to the first solder ball that provides an external electrical connection to the substrate for a voltage external to the substrate.