Multi-chip Package Design Automation via 3D Simulation
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Solution Overview
Problem
The conventional packaging design process is time-consuming and prone to misjudgment due to manual adjustments, which can lead to suboptimal circuit layouts and functional verification failures.
Innovation Solution
A multi-chip integrated package design method and system that involves obtaining a schematic of a design circuit, performing a circuit layout, constructing a 3D model, determining if characteristic parameters meet design targets, and optimizing the design using a patent database when targets are not met.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If manual adjustment is used in conventional packaging design process, then design flexibility is maintained, but time consumption increases and misjudgment occurs
Solution Approach 1:
The system performs self-service by automatically conducting simulation analysis and generating layout optimization suggestions without requiring manual intervention. The electrical engineer input receives automatic processing through simulation analysis that identifies potential issues and generates optimization recommendations, eliminating the need for time-consuming manual adjustments while maintaining design quality.
Solution Approach 2:
The patent replaces the manual mechanical adjustment process with an automated simulation-based system. Instead of engineers manually adjusting layouts based on experience, the system uses simulation analysis to automatically evaluate designs and generate optimization suggestions, substituting human manual work with computational automation.
2Manufacturing precision
If conventional manual design process is used, then design simplicity is maintained, but design precision and reliability deteriorate
Solution Approach 1:
The simulation analysis module serves as an intermediary between the electrical engineer input and the final circuit layout. It automatically evaluates designs against electrical specifications and generates optimization suggestions, acting as a mediator that improves precision without requiring complex manual intervention processes.
Solution Approach 2:
The system implements feedback by using simulation analysis to evaluate the electrical engineer input and generate optimization suggestions. This closed-loop feedback mechanism automatically identifies issues in the circuit layout and provides targeted improvements, enhancing design precision through iterative automated refinement rather than complex manual processes.
3Productivity
If automated simulation analysis is implemented, then design efficiency is improved, but system complexity increases
Solution Approach 1:
The system segments the design process into distinct automated modules: simulation analysis that evaluates electrical specifications, and an optimization suggestion generator that produces layout improvements. This segmentation allows each module to perform its function efficiently and independently, improving overall design productivity while managing system complexity through modular architecture.
Data Source
AI summary
A multi-chip integrated package design system includes a model analysis, a 3D model analysis and an electrical simulation. The model analysis obtains a pin connection mode of the designed circuit according to a designed circuit, obtains at least one conductive layer of the designed circuit according to a layer stackup, selects a transmission line model that meets the pin connection mode and at least one conductive layer, substitutes the layer stackup and a design rule into the selected transmission line model to generate an equivalent circuit, generates a corresponding relationship according to the equivalent circuit, and obtains the transmission line length corresponding to a parameter design target according to the corresponding relationship. The 3D model analysis constructs a 3D model of the designed circuit according to the obtained the transmission line length. The electrical simulation determines whether the characteristic parameter of the 3D model meets the parameter design target.