Multi-Chip Package Structure With Heat Dissipation Plate
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Solution Overview
Problem
Conventional semiconductor packaging technologies face challenges in achieving high-density fine interconnection and effective heat dissipation for multi-chip packages, particularly for high-power density chips, as they often result in large dimensions, low interconnection line density, and inadequate heat management.
Innovation Solution
A multi-chip interconnection package structure incorporating a heat dissipation plate that is integrated with a fine circuit layer, die, and plastic package body, where the heat dissipation plate is mounted on a side of the die away from the circuit layer, enabling direct thermal contact and enhanced heat transfer through a thermally conductive adhesive layer, and the package structure includes conductive holes and layers for electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional packaging technology with good heat dissipation is used, then heat dissipation capability is improved, but interconnection line density decreases and dimension increases
Solution Approach 1:
The invention divides the package structure into distinct functional layers: a fine circuit layer for high-density interconnection, a die mounting layer for the semiconductor chip, and a heat dissipation plate layer for thermal management. This segmentation allows each layer to be optimized independently - the fine circuit layer achieves high interconnection density while the heat dissipation plate provides effective thermal management without compromising the other.
Solution Approach 2:
The invention transitions from planar heat dissipation to three-dimensional heat dissipation by introducing a heat dissipation plate that extends vertically from the package substrate. The plate includes a first heat dissipation surface facing the die and a second heat dissipation surface exposed on the package body, creating multiple thermal pathways in different spatial dimensions and significantly improving heat dissipation capability.
2Manufacturing precision
If high-density fine interconnection technology is used, then interconnection line density is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The package structure is segmented into a fine circuit layer for high-density interconnection and a separate heat dissipation plate for thermal management. This allows the fine circuit layer to achieve high interconnection density without being constrained by heat dissipation requirements, while the dedicated heat dissipation plate handles thermal management independently.
Solution Approach 2:
The heat dissipation plate acts as an intermediary between the die and the package environment. It receives heat from the die through its first heat dissipation surface and dissipates it to the surroundings through its second heat dissipation surface, effectively decoupling the heat dissipation function from the fine interconnection layer and enabling both high density and effective thermal management.
3Adaptability or versatility
If multiple chips are embedded into a package body, then functionality is improved, but heat generation increases
Solution Approach 1:
The heat dissipation plate serves multiple functions: it provides thermal management for multiple chips mounted on the package, acts as a mechanical support structure, and offers additional mounting surfaces for extra chips. This multi-functionality allows the package to accommodate multiple chips with different functional requirements while maintaining effective heat dissipation for all of them through the shared heat dissipation plate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation capabilities while maintaining fine interconnection and high-density packaging requirements, effectively addressing the limitations of prior art by rapidly transferring heat generated by the die and circuit layer to the outside, thus enhancing the thermal management of the package.
Implementation Method 1
enabling direct thermal contact and enhanced heat transfer through a thermally conductive adhesive layer
Data Source
AI summary
A multi-chip interconnection package structure with a heat dissipation plate and a preparation method thereof are provided. The multi-chip interconnection package structure with a heat dissipation plate includes a fine circuit layer, at least one die, a heat dissipation plate, a plastic package body, and a package circuit layer, the heat dissipation plate is provided on the fine circuit layer, and is mounted on a side of the die away from the fine circuit layer, the plastic package body wraps the die and the heat dissipation plate, and the package circuit layer is provided on the plastic package body.