Multichip Package System With Molding Transfer Channels
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Solution Overview
Problem
Existing multichip package technologies face challenges in reducing package dimensions and costs while minimizing adverse interactions like cross-talk between integrated circuits, and current solutions have not effectively addressed these issues.
Innovation Solution
A multichip package system is developed with a substrate featuring molding transfer channels that allow for the concurrent encapsulation of integrated circuit dies on both sides with a molding compound, reducing manufacturing steps and package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If integrated circuit stacking is used to reduce package dimensions, then package size is reduced, but manufacturing complexity increases due to multi-step molding processes
Solution Approach 1:
The patent combines multiple molding operations into a single concurrent encapsulation process. Molding transfer channels are formed in the substrate to enable molding compound to simultaneously encapsulate multiple integrated circuit dies stacked on both top and bottom sides of the substrate, eliminating the need for separate molding steps for each die.
Solution Approach 2:
The substrate is segmented with multiple molding transfer channels that divide and direct the molding compound flow to different regions. These channels are formed through the substrate thickness, allowing independent control of molding compound flow to top-side and bottom-side dies while maintaining a unified processing step.
2Quantity of substance
If mixed integrated circuit technology or system in package is used to reduce space, then integration density is improved, but adverse interactions such as cross talk occur between integrated circuits
Solution Approach 1:
The patent extracts or removes molding transfer channels from the substrate structure to create flow paths for molding compound. These channels are formed by removing material through the substrate thickness, allowing the molding compound to reach and encapsulate dies on both sides while the removed material spaces can be used for signal shielding or isolation structures.
3Ease of manufacture
If existing manufacturing methods are reused to reduce cost, then manufacturing cost is reduced, but package dimensions are not reduced
Solution Approach 1:
The substrate serves multiple functions: it provides mechanical support for the integrated circuit dies, contains embedded molding transfer channels for compound flow, and can incorporate signal shielding structures. This multi-functionality allows existing substrate manufacturing processes to be used while achieving reduced package dimensions through the integrated molding approach.
Data Source
AI summary
A multichip package system is provided forming a substrate having a plurality of molding transfer channel, connecting a first integrated circuit die on a top side of the substrate, connecting a second integrated circuit die on a bottom side of the substrate, and concurrently encapsulating the first integrated circuit die and the second integrated circuit die with a molding compound flow through the plurality of the molding transfer channels.