Multi-chip Package Test Circuit for Internal Signal Short Detection
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Solution Overview
Problem
Existing multi-chip packages face challenges in detecting failures of internal signal lines that are not connected to external terminals, which can lead to short-circuits and affect the proper functioning of electronic devices.
Innovation Solution
Incorporating a test circuit within the multi-chip package that enables the transmission of complementary data through internal signal lines to detect short-circuits by forming current paths between power voltage and ground voltage, allowing for the identification of defective bonding wires without increasing the number of terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If internal signal lines are not connected to external terminals, then the multi-chip package achieves miniaturization and reduced terminal count, but the ability to detect short-circuits in internal signal lines is lost
Solution Approach 1:
The patent introduces a test circuit as an intermediary component that enables indirect detection of internal signal lines. The test circuit includes test signal input terminals that receive test signals and routing control circuits that control signal transmission paths through internal signal lines, allowing detection without external access to the internal lines themselves
Solution Approach 2:
The patent segments the detection function by separating it from the main signal transmission path. The test circuit is divided into distinct functional blocks: test signal input terminals, routing control circuits, and detection circuits. This segmentation allows independent testing of internal signal lines while maintaining the compact package structure
2Reliability
If a test circuit is added to detect internal signal line short-circuits, then defect detection capability is improved, but the device complexity increases
Solution Approach 1:
The routing control circuits serve multiple functions: they control test signal transmission paths during defect detection, and they also manage normal signal routing during operation. This multi-functionality reduces the need for separate dedicated test components, thereby limiting the increase in device complexity
Solution Approach 2:
The patent merges the test circuit with existing package structures by integrating it into the multi-chip package architecture. The test circuit shares physical space and structural elements with the main functional circuits, combining defect detection capabilities with the existing package design rather than adding completely separate testing infrastructure
Data Source
AI summary
A multi-chip package capable of testing internal signal lines including a printed circuit board, a first semiconductor chip mounted on the printed circuit board and including a test circuit, and second semiconductor chips mounted on the printed circuit board and electrically connected to the first semiconductor chip via a plurality of internal signal lines may be provided. The test circuit may be configured to enable circuits of the first semiconductor chip connected to pads contacting the plurality of internal signal lines, transmit complementary data to at least two pads from among the pads, and form a current path in the circuits connected to the at least two pads, thereby detecting a short-circuit between the internal bonding wires.