Multi-Chip Package Thermal Parameter Reporting
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Solution Overview
Problem
The increasing power requirements and energy consumption of computing systems, particularly in multichip packages with processors, pose a significant challenge for energy efficiency and conservation, as they contribute substantially to overall electricity usage and require innovative power management solutions.
Innovation Solution
The implementation of integrated voltage regulators (IVRs) within each core of a multicore processor allows for fine-grained control of voltage and power, enabling independent operation of cores and power planes, along with a power control unit (PCU) for dynamic voltage frequency scaling and workload management, to optimize power consumption based on workload and thermal constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple hardware threads, multiple cores, multiple devices are integrated on individual integrated circuits to increase logic density and performance, then computing power and functionality are improved, but power requirements and energy consumption escalate significantly
Solution Approach 1:
The patent segments the integrated circuit into multiple independent power domains, each with its own power management controls. This allows different regions of the chip to be powered independently based on their specific needs, reducing overall power consumption while maintaining high-performance computing capabilities in active regions.
Solution Approach 2:
The patent implements dynamic power management that adjusts voltage and frequency levels in real-time based on workload demands. Power domains can be dynamically activated or deactivated, and operating parameters can be adjusted on-the-fly to optimize the balance between computing performance and power consumption.
2Productivity
If integrated circuits are designed with higher density and performance to meet computing demands, then processing capability is improved, but energy consumption increases substantially
Solution Approach 1:
The patent applies different power management characteristics to different local regions of the integrated circuit. Each power domain can have customized voltage, frequency, and power state configurations tailored to its specific functional requirements, allowing high-performance regions to operate at full capability while low-activity regions consume minimal power.
Solution Approach 2:
The patent utilizes dynamic changes in electrical parameters (voltage, frequency, power states) to optimize the trade-off between processing capability and energy consumption. By adjusting these parameters based on actual workload conditions, the system achieves high processing performance when needed while minimizing energy loss during low-activity periods.
Data Source
AI summary
In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.