Multi-Chip Signal Filtering for Low-Noise Package Interconnects
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Solution Overview
Problem
In multi-chip modules, signal noise induced by connection elements in signal transmission paths between chips degrades total harmonic distortion (THD) of signals, particularly due to interactions between high-frequency components and parasitic inductance and capacitance of conductive pads and connection wires.
Innovation Solution
The electronic package device includes a first chip with a signal control circuit that filters and amplifies input signals before transmitting them through a connection wire to a second chip, which further filters and amplifies the signals. This configuration reduces noise by filtering high-frequency components before they interact with transmission elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection wires and conductive pads are used to transmit signals between chips, then signal transmission is enabled, but signal noise is induced due to interaction with high-frequency components
Solution Approach 1:
The patent applies preliminary action by filtering high-frequency components from the signal before it enters the transmission path through connection wires and conductive pads. The filtering circuit removes problematic frequency components in advance, preventing them from interacting with parasitic inductance and capacitance in the transmission elements, thus eliminating noise generation at its source rather than attempting to clean the signal after transmission.
2Manufacturing precision
If high-frequency components are transmitted through connection elements, then signal bandwidth is maintained, but total harmonic distortion degrades due to interaction with parasitic inductance and capacitance
Solution Approach 1:
The patent applies the extraction principle by removing high-frequency components from the signal spectrum before transmission. The filtering circuit selectively extracts and eliminates the problematic high-frequency portions of the signal that would otherwise interact with parasitic inductance and capacitance in connection elements, thereby preventing total harmonic distortion while maintaining the integrity of the remaining signal components.
3Object-affected harmful factors
If filtering circuits are added to remove high-frequency components, then signal noise is reduced, but device complexity increases
Solution Approach 1:
The patent applies local quality by implementing filtering functionality only at specific critical points in the signal path - namely at the transmitter side before signal entry into connection elements and at the receiver side after signal extraction from connection elements. This localized approach to filtering addresses noise problems where they most critically affect signal quality while avoiding unnecessary complexity throughout the entire system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces transmission noise, simplifies connection wires between chips, saves area and cost of transmission elements, and improves signal quality by filtering high-frequency components before they reach the transmission path.
Implementation Method 1
filtering circuits to remove high-frequency components from input signals
Implementation Method 2
amplifier circuits to amplify the filtered signals
Data Source
AI summary
An electric package device is provided, including a first chip and a second chip. The first chip includes a first conductive pad. The second chip includes a second conductive pad. The second conductive pad couples to the first conductive pad through a connection wire. In some embodiments, the first chip includes a first signal control circuit that receives, in response to a selection signal, one of multiple input signals as a first signal, filters the first signal, and outputs the filtered first signal, as a second signal, from the first conductive pad to the second conductive pad.