Multi-Chip Module Thermal Control With Chip-Specific Temperature Points
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Increasing power consumption in computer systems to enhance performance leads to thermal issues, causing performance throttling due to mismatched thermal control points across chips in multi-chip modules.
Innovation Solution
Predetermining separate thermal control points for each chip in a multi-chip module based on power needs and thermal characteristics, allowing for individual temperature management and performance adjustments, enabling higher power and frequency operations while maintaining optimal thermal conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If power consumption is increased to enhance performance, then system performance is improved, but thermal issues arise causing performance throttling
Solution Approach 1:
The patent assigns different thermal control points to different chips within the multi-chip module based on their individual power needs and thermal characteristics. This localized approach allows each chip to operate at its optimal temperature threshold rather than enforcing a uniform thermal limit across all chips, thereby enabling higher overall system performance without causing thermal throttling.
2Device complexity
If a common thermal control point is used for all chips, then device complexity is reduced, but thermal management precision deteriorates
Solution Approach 1:
The patent changes the thermal control parameter from a single common threshold to multiple chip-specific thresholds. Each chip is assigned a predetermined thermal control point that reflects its unique power consumption characteristics and thermal behavior. This parameter differentiation enables precise thermal management for each chip while maintaining a relatively simple overall control structure.
Data Source
AI summary
Thermal control of a multi-chip module in an operating environment is facilitated by predetermining separate thermal control points for multiple chips of the multi-chip module, with a first chip and a second chip having different predetermined thermal control points, and saving the predetermined thermal control points for reference by a thermal control of the multi-chip module in an operating environment. The thermal control monitors an operating temperature of the first chip, and compares the operating temperature of the first chip to the predetermined thermal control point of that chip. The thermal control further initiates a control action to control temperature of the first chip based on comparing the operating temperature of the first chip to the predetermined thermal control point of the first chip.