Multi-Chip Transformer Wiring Layout for Low-Interference Signal Links
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Solution Overview
Problem
Existing signal transmission devices face challenges in efficiently connecting multiple chips and transformers within a small package structure, leading to potential signal interference and reduced reliability.
Innovation Solution
The signal transmission device employs a novel configuration with multiple chips and transformers connected via inter-chip wires and terminal wires made of specific materials, including gold and copper or aluminum, to enhance electrical connectivity and reduce interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple chips and transformers are connected within a small package structure, then device integration is improved, but signal interference increases and reliability decreases
Solution Approach 1:
The package structure is segmented into multiple isolated connection paths between chips and transformers. Each signal transmission path has its own dedicated wire connections, preventing signal interference between adjacent paths. This segmentation allows high integration density while maintaining signal integrity through physical isolation of electromagnetic fields.
Solution Approach 2:
Ground wires and shielding structures are introduced as intermediary elements between signal-carrying wires. These intermediary components act as electromagnetic shields and reference potential planes, mediating the electromagnetic environment to reduce interference between adjacent signal paths while enabling compact packaging.
2Productivity
If chip density is increased in the package, then productivity is improved, but signal interference increases
Solution Approach 1:
Different regions of the package are assigned different functional qualities: signal transmission regions use controlled impedance wire routing with specific geometric characteristics, while adjacent regions use ground shielding or isolation structures. This local differentiation of structural qualities enables high chip density while maintaining low signal interference through spatially optimized electromagnetic characteristics.
Solution Approach 2:
The connection architecture transitions from planar two-dimensional routing to three-dimensional multi-layer wiring. Signal wires are routed through multiple vertical layers with ground planes interspersed between them, utilizing the third dimension to separate signal paths and reduce electromagnetic coupling. This dimensional transition enables higher chip density without proportionally increasing signal interference.
Data Source
AI summary
A signal transmission device includes a first chip including a first transformer, a second chip, first terminals, second terminals, third terminals, inter-chip wires, and first terminal wires. The inter-chip wires separately connect the first chip to the second chip. The inter-chip wires separately connect the first chip to the third chip. The first terminal wires separately connect the first chip to the first terminals. The inter-chip wires are formed from a material including gold. The first terminal wires are formed from a material including copper or aluminum.