Multi-PCB Layout for High-Speed Data Transmission in 2U Rackmount Switches
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Solution Overview
Problem
Traditional rackmount network devices face challenges in achieving higher data transmission speeds due to size constraints, as the limited space on circuit boards necessitates insufficient component arrangements that fail to support increased data transmission speeds.
Innovation Solution
A multi-PCB layout where a switch-fabric circuit board is positioned between two optic circuit boards, facilitating communicative connectivity among packet forwarding engines and reducing the length of electrical traces, thereby supporting higher data transmission speeds within the size constraints of a 2U rackmount switch or router.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If components are arranged on one or two PCBs to fit size constraints, then the device fits within the 2U rackmount form factor, but the electrical trace lengths become too long to support higher data transmission speeds
Solution Approach 1:
The device is segmented into multiple PCB assemblies (front PCB, rear PCB, intermediate PCBs) rather than using a single large PCB. This segmentation allows each PCB to be compact while collectively achieving the required component density and trace length specifications for high-speed data transmission within the 2U form factor.
Solution Approach 2:
The patent transitions from a two-dimensional PCB layout to a three-dimensional stacked PCB architecture. By arranging PCBs in multiple layers (front, rear, intermediate) and using vertical interconnects, the design achieves shorter effective trace lengths and better signal integrity without increasing the external device footprint.
2Productivity
If the number of components is increased to support higher data transmission speeds, then performance improves, but the available space on traditional PCBs becomes insufficient
Solution Approach 1:
Components are distributed across multiple PCB assemblies rather than crowded onto a single PCB. The front PCB contains certain components, the rear PCB contains others, and intermediate PCBs provide connectivity, allowing each individual PCB to maintain manageable component density while the system as a whole supports high-speed data transmission.
Solution Approach 2:
Multiple PCB assemblies are nested within the compact 2U form factor housing. The intermediate PCBs are positioned between the front and rear PCBs, creating a nested arrangement that maximizes the use of available three-dimensional space while maintaining short electrical trace lengths between components.
Data Source
AI summary
The disclosed apparatus may include (1) a switch-fabric circuit board that includes at least one switch-fabric circuit that facilitates communicative connectivity between packet forwarding engines within a rackmount network device and (2) a plurality of optic circuit boards that are each communicatively connected to the switch-fabric circuit board. In this example, the optic circuit boards may include a plurality of packet forwarding engines that are communicatively connected to one another via the switch-fabric circuit and a plurality of communication ports that are each communicatively connected to at least one of the packet forwarding engines. In addition, the switch-fabric circuit board may reside between at least two of the optic circuit boards within the rackmount network device. Various other apparatuses, systems, and methods are also disclosed.