Multicolor Monolithic LED Array With Coplanar Die Isolation
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Solution Overview
Problem
Existing methods for manufacturing multicolor LED arrays face challenges in efficiently and cost-effectively handling LED die of different colors and configurations, particularly due to varying semiconductor-containing structures and heights, which complicate handling and lead to issues like light cross-talk.
Innovation Solution
A multicolor monolithic LED array is constructed by assembling LED die of different colors and configurations in a coplanar configuration, using a reflective coating to retain and planarize the die, and a method involving a support structure to ensure uniform die heights, followed by removal from the support and attachment to a device substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If LED die of different colors and configurations are assembled individually on a support, then the array can accommodate diverse semiconductor structures, but handling becomes challenging and manufacturing efficiency decreases
Solution Approach 1:
The patent divides the LED array into modular pixels, where each pixel contains multiple LED die of different colors (red, green, blue) arranged in a specific configuration. This segmentation allows each pixel to be treated as a standardized unit, simplifying handling and assembly while maintaining the ability to accommodate diverse semiconductor structures within each pixel module.
Solution Approach 2:
The patent creates a universal pixel structure that can accommodate multiple types of LED die (different colors, configurations, and semiconductor structures) within a single standardized framework. This multi-functional pixel design enables the same assembly process to handle diverse LED types, improving manufacturing efficiency without sacrificing adaptability.
2Adaptability or versatility
If LED die of different heights are assembled in an array, then diverse color configurations are achieved, but light cross-talk between adjacent die increases
Solution Approach 1:
The patent applies local quality by providing each LED die with its own dedicated reflective cavity and individualized reflective coating. This localized structure ensures that light from each die is contained and directed independently, preventing cross-talk between adjacent die while maintaining the ability to use LED die of different heights for various color configurations.
Solution Approach 2:
The patent implements a nested structure where each LED die is positioned within its own reflective cavity formed in the reflective coating. These cavities are nested within the overall pixel structure, creating hierarchical containment that isolates light from each die while organizing multiple die of different heights in a compact, cross-talk-free arrangement.
3Object-generated harmful factors
If LED die are retained by a reflective coating, then light cross-talk is reduced and die are held in position, but the manufacturing process complexity increases
Solution Approach 1:
The patent merges multiple functions into the reflective coating layer: it serves as both the optical element (reflective surface to contain light and reduce cross-talk) and the structural element (matrix that holds LED die in position). This consolidation reduces the number of separate components and assembly steps, simplifying manufacturing despite the advanced functionality provided.
Solution Approach 2:
The reflective coating is designed as a multi-functional component that simultaneously provides optical isolation (reducing light cross-talk through reflective cavities) and mechanical support (holding LED die in positioned). This universal component eliminates the need for separate optical and structural elements, reducing overall device complexity.
4Ease of operation
If planarization is performed to achieve uniform die heights, then coplanar configuration is achieved for efficient handling, but manufacturing time and cost increase
Solution Approach 1:
The patent performs planarization of the reflective coating and positioning of LED die during the initial array fabrication process, before the array is detached from the support structure. This preliminary action ensures that when the array is later handled and assembled, all LED die are already in a coplanar configuration, eliminating the need for additional planarization steps and reducing manufacturing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient handling and manufacturing of multicolor LED arrays with reduced light cross-talk, enabling uniform attachment to device substrates and facilitating control of individual pixels.
Implementation Method 1
disposed a reflective material on the plurality of LED die that retains the plurality of LED die in the spaced apart configuration
Data Source
AI summary
Described are multicolor monolithic light-emitting diode (LED) arrays comprising: multicolor pixels comprising a plurality of light emitting diode (LED) die including: a first set of LED die each of a first die height and configured to emit a first color light; a second set of LED die each of a second die height and configured to emit a second color light; a third set of LED die each of a third die height and configured to emit a third color light; and the first die height being substantially equal to the second die height and the third die height; and the plurality of LED die having a coplanar configuration and being spaced apart and retained by a reflective coating.