Multi-Color LED Package Layout for Compact Independent Emission
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Solution Overview
Problem
Existing light emitting diode (LED) devices have complex manufacturing processes and require separate production and mounting of individual color LEDs, making them difficult to integrate into simple and compact devices.
Innovation Solution
A light emitting device package with a simple structure featuring a printed circuit board, epitaxial stacks emitting different wavelength bands, and a molding layer that partially reflects, scatters, or absorbs external light, allowing for the integration of multiple colors in a small area and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual color LEDs are produced and mounted separately, then each LED can be optimized for its specific color, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The patent combines multiple LED chips of different colors (red, green, blue) into a single integrated light emitting device. Multiple epitaxial stacks are formed on a single substrate, allowing all color LEDs to be manufactured simultaneously in one process rather than separately producing and mounting individual LEDs.
Solution Approach 2:
The single light emitting device performs multiple functions by integrating different color LEDs into one structure. The device can emit multiple colors simultaneously or independently, replacing what would traditionally require separate LED components for each color.
2Ease of operation
If individual color LEDs are mounted separately, then each LED can be independently controlled, but the device size increases and integration becomes difficult
Solution Approach 1:
Multiple LED chips are integrated into a single compact device structure on one substrate, dramatically reducing the overall device volume compared to mounting separate LEDs. The shared substrate and common control circuitry enable space-efficient integration.
Solution Approach 2:
The patent arranges multiple LED chips in a vertical stacked configuration on the substrate rather than spreading them out in a plane. This three-dimensional integration approach reduces the device footprint while maintaining independent control capability for each color channel.
3Adaptability or versatility
If multiple individual LEDs are used, then color variety is achieved, but the manufacturing time and cost increase
Solution Approach 1:
The manufacturing process merges multiple LED production lines into one by forming multiple epitaxial stacks simultaneously on a single substrate. This batch processing approach produces multiple color LEDs in one manufacturing cycle, significantly improving productivity and reducing costs compared to sequential production.
Solution Approach 2:
The substrate is prepared in advance with multiple epitaxial stacks already formed during the initial growth process. This preliminary formation of multiple LED structures on one substrate allows for simultaneous fabrication and testing, streamlining the manufacturing workflow and reducing overall production time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of high-resolution, compact light emitting devices with simplified manufacturing, where multiple colors can be integrated in a small area, improving device miniaturization and manufacturing efficiency.
Implementation Method 1
the molding layer covers an upper surface of the substrate and partially reflect, scatter, or absorb external light
Implementation Method 2
the molding layer covers an upper surface of the substrate and partially reflect, scatter, or absorb external light
Implementation Method 3
the molding layer covers an upper surface of the substrate and partially reflect, scatter, or absorb external light
Data Source
AI summary
A light module including a base substrate having a front surface, first and second electrodes disposed on the front surface, first and second emitters disposed on the front surface, a first molding covering the first emitter, and a second molding layer covering the second emitter, in which the first and second electrodes include a first region and a second region exposed from the base substrate, and an embedded region between the first region and the second region and not exposed to the outside, and a distance between the second region of the first electrode connected to the first emitter and the second region of the second electrode connected to the second emitter is shorter than a distance between the first region of the first electrode connected to the first emitter and the first region of the second electrode connected the second emitter.