Multi-Color Micro-LED Stacked Bonding for High-Resolution Integration
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Solution Overview
Problem
Conventional LED display systems face challenges in achieving high resolution, efficient fabrication, and reliable integration of micro LEDs with pixel driver circuits, leading to issues such as high power consumption, light cross-talk, and thermal stress.
Innovation Solution
The proposed multi-color LED device integrates multiple micro-LED structures with stacked bonding structures, allowing for efficient fabrication and integration by bonding light emitting layers directly onto the substrate with pixel drivers, eliminating the need for intermediate substrates and reducing thermal mismatch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional pick-and-place fabrication method is used to transfer micro LEDs from separate substrate to control circuitry substrate, then integration of LEDs with driver circuits is achieved, but fabrication efficiency is low, cost is high, and reliability is poor
Solution Approach 1:
The patent merges the LED fabrication and transfer processes by bonding the LED array directly to the control circuitry substrate in a single alignment step, eliminating the separate pick-and-place transfer operation. This combines multiple fabrication steps into one integrated process, improving both efficiency and mass production capability.
Solution Approach 2:
The patent extracts the intermediate substrate step from the conventional fabrication process. By removing the intermediate substrate that was previously required for LED preparation and transfer, the process is simplified to direct bonding between LED array and control circuitry substrate, eliminating unnecessary steps and improving productivity.
2Reliability
If entire LED array with original substrate is bonded to control circuitry using metal bonding, then integration is achieved, but light cross-talk occurs and thermal mismatch generates stress at bonding interface
Solution Approach 1:
The patent extracts and removes the original LED substrate from the final assembly. By bonding only the LED array structure (without the original substrate) to the control circuitry substrate, the source of thermal mismatch and light cross-talk is eliminated while maintaining bonding reliability.
Solution Approach 2:
The patent converts the potential harm of substrate-related thermal mismatch and light interference into a benefit by selectively removing the problematic substrate portion. The bonding interface is optimized to maintain mechanical strength while eliminating the sources of thermal stress and optical cross-talk.
3Adaptability or versatility
If multi-color display panels use different color LEDs grown on different substrate materials, then color diversity is achieved, but manufacturing process becomes more complicated and inefficient
Solution Approach 1:
The patent merges multiple LED structures with different substrate materials into a single integrated array structure. By combining red, green, and blue LED elements (each potentially from different substrate materials) into one unified array that bonds directly to the control substrate, the manufacturing process is simplified while maintaining color diversity.
Solution Approach 2:
The patent creates a universal bonding interface that accommodates multiple types of LED structures with different substrate materials. The control circuitry substrate serves as a common platform for integrating diverse LED types, enabling multi-color functionality without requiring separate processing lines for each color.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances fabrication efficiency and reliability, reduces power consumption, and improves display resolution, making it suitable for demanding applications such as augmented reality, mobile devices, and automotive displays.
Implementation Method 1
a first bonding layer is formed between the first light emitting layer and the second light emitting layer
Data Source
AI summary
A single pixel multi-color LED device includes two or more LED structures for emitting a range of colors. The two or more LED structures are horizontally formed as sub-pixels to combine light. In some embodiments, two or more light emitting layers are formed on a substrate with integrated circuits and the two or more light emitting layers are bonded together with bonding layers. In some embodiments, the two or more LED structures are formed by utilizing a respective top light emitting layer of the respective LED structure and by removing extra top light emitting layer(s) with the respective LED structure. In some embodiments, the up and down orientation of the P-type region and the N-type region within the first light emitting layer is different from the up and down orientation of the P-type region and the N-type region within the second light emitting layer.