Multi-Column Electron Beam Inspection for Higher Wafer Throughput

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Solution Overview

Problem

Current inspection methods, particularly electron beam inspection systems, face challenges in achieving high throughput and resolution for inspecting small defects and features in semiconductor manufacturing, as single beam column systems are constrained by throughput and resolution limitations.

Innovation Solution

Implementing a multi-beam column electron beam inspection system with multiple electron beams arranged in an array to inspect different fields or dies simultaneously, utilizing an actuator system for relative movement between the electron beam columns to enhance inspection efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a single beam column system is used for electron beam inspection, then the device complexity is low, but the throughput and resolution are limited

Engineering Contradiction:
Improveinspection throughputVSAvoidsystem complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The inspection system is divided into multiple independent beam columns, each capable of inspecting different fields or dies simultaneously. This segmentation allows parallel processing of multiple inspection areas, significantly increasing throughput while maintaining manageable complexity through modular architecture

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple beam columns are combined into a single inspection system that operates in parallel. The merging of multiple inspection capabilities into one unified system achieves high throughput by simultaneously inspecting multiple areas without requiring separate inspection devices

Inventive Principle:
Principle #5Merging (Combining)

2Productivity

If multiple electron beam columns are used to inspect different fields simultaneously, then the throughput improves, but the device complexity increases

Engineering Contradiction:
Improveinspection throughputVSAvoidnumber of beam columns
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The system segments the inspection task across multiple beam columns, with each column dedicated to specific fields or dies. This segmentation enables parallel inspection operations that multiply throughput while the modular nature keeps each column's complexity manageable

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system transitions from single-point sequential inspection to multi-point parallel inspection by adding spatial dimensionality. Multiple beam columns operate simultaneously at different locations on the wafer, converting a one-dimensional sequential process into a two-dimensional parallel process

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If the electron beam columns are moved relative to each other using an actuator system, then the inspection flexibility and coverage improve, but the device complexity and cost increase

Engineering Contradiction:
Improveinspection flexibilityVSAvoidactuator system complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The actuator system enables dynamic repositioning of beam columns relative to each other and to the wafer. This dynamic capability allows the system to adapt to different inspection scenarios, field sizes, and wafer positions, providing versatility while the automated control manages the complexity of movement coordination

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The multi-beam column system significantly improves throughput and resolution, enabling faster and more effective detection of defects and features in semiconductor wafers, bridging the gap between single beam column systems and bright-field inspection.

Implementation Method 1

a plurality of electron beam columns, each electron beam column configured to provide an electron beam and detect scattered or secondary electrons from the object

Methodology Applied
Scientific EffectElectron beam: Electron Beam

Data Source

PatentUS12500063B2Method and apparatus for inspection
Publication Date: 2025.12.16 ASML NETHERLANDS BV
  • US12500063B2 patent drawing
  • US12500063B2 patent drawing
  • US12500063B2 patent drawing

AI summary

An electron beam inspection apparatus, the apparatus including a plurality of electron beam columns, each electron beam column configured to provide an electron beam and detect scattered or secondary electrons from an object, and an actuator system configured to move one or more of the electron beam columns relative to another one or more of the electron beam columns, the actuator system including a plurality of first movable structures at least partly overlapping a plurality of second movable structures, the first and second movable structures supporting the plurality of electron beam columns.