Integrated Multicomponent Connector for Heat and Power Handling
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Solution Overview
Problem
The challenge of miniaturizing high-frequency components for 5G spectrum applications while ensuring effective heat management and power handling has increased due to the demand for smaller, passive components.
Innovation Solution
A multicomponent connector assembly with a first and second support member, featuring a heat sink component made of thermally conductive yet electrically non-conductive material, and slots for multiple components, allowing for parallel connection and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple components are mounted separately, then each component can be individually optimized, but mounting space increases and power handling capability decreases
Solution Approach 1:
The patent combines multiple passive components (capacitors, resistors, inductors) and heat sinks into a single integrated multicomponent connector assembly. This merging allows the components to share a common mounting footprint while increasing overall power handling capability through parallel connections and improved thermal management.
Solution Approach 2:
The connector assembly serves multiple functions simultaneously: it provides electrical connections for high-frequency signals, mounts multiple passive components, and dissipates heat through integrated heat sinks. This multi-functionality reduces the need for separate mounting structures for each function.
2Area of stationary object
If components are miniaturized, then mounting space is reduced, but heat management becomes more difficult
Solution Approach 1:
The patent nests heat sink structures within and around the component housing, allowing heat dissipation surfaces to be integrated into the compact assembly without increasing the external footprint. The heat sinks are positioned to maximize thermal contact with power-dissipating components while maintaining a small overall form factor.
Solution Approach 2:
The patent introduces thermally conductive, electrically non-conductive materials as intermediaries between power-dissipating components and heat sinks. These materials efficiently transfer heat while preventing electrical short circuits in the high-frequency environment.
3Area of stationary object
If components are mounted in a compact arrangement, then mounting space is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the connector assembly into modular sections, each housing specific components (capacitors, resistors, inductors, heat sinks). This segmentation allows for standardized manufacturing of individual modules that can be assembled through straightforward mounting processes, reducing overall manufacturing complexity despite the compact integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reduced footprint, enhanced power handling, and efficient heat management by conducting heat away from high-frequency components, facilitating customized component values and configurations.
Implementation Method 1
a heat sink component having a body that includes a thermally conductive material that is electrically non-conductive such that the heat sink component is configured to conduct heat from a first area to a second area
Data Source
AI summary
The present disclosure provides multicomponent connector assemblies and methods of forming such assemblies. For example, a multicomponent connector assembly includes a multicomponent connector having first and support members and also includes a plurality of components disposed between the first and second support members. At least one of the plurality of components may be a heat sink component configured to conduct heat from a first area to a second area. Additionally, or alternatively, the plurality of components may include a capacitor, a resistor, a varistor, an inductor, or the like. In at least some connectors, a plurality of slots are defined, and at least one component is disposed between the first and support members in a respective one slot of the plurality of slots.