Multi-Die Module Coupling Loss Reduction Structure
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Solution Overview
Problem
Existing IC fabrication technologies limit the integration of different types of components, leading to performance drawbacks in multi-die circuit packaging, particularly due to unwanted coupling losses in contactless coupling methods like inductive coupling, which reduce the quality factor of oscillator circuits.
Innovation Solution
A multi-die module with a contactless coupler and coupling loss reduction structures, such as cavities, magnetic materials, or redistribution layers, is designed to convey signals between dies, reducing signal loss and distortion by optimizing the placement and configuration of these structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If contactless coupling is used to convey signals between dies, then packaging flexibility is improved, but coupling loss increases and quality factor deteriorates
Solution Approach 1:
A coupling loss reduction structure is introduced as an intermediary element between the contactless coupler and the substrate. This structure mediates the electromagnetic field interaction, reducing unwanted coupling losses while maintaining the contactless coupling mechanism. The structure includes a first portion adjacent to a first contactless coupler component and a second portion adjacent to a second contactless coupler component, creating optimized field pathways.
Solution Approach 2:
The coupling loss reduction structure modifies the electromagnetic field distribution parameters by introducing specific geometric configurations and material properties. The structure changes the field confinement and coupling characteristics, transforming the lossy coupling mode into a more efficient mode while preserving packaging flexibility.
2Ease of operation
If inductive coupling is used in oscillator circuits, then contactless signal transmission is achieved, but quality factor is reduced
Solution Approach 1:
The coupling loss reduction structure serves as a mediator between the inductive coupler and the oscillator circuit, reducing the detrimental impact on quality factor. By positioning the structure adjacent to the contactless coupler components, it optimizes the magnetic field interaction and minimizes energy dissipation, thereby preserving the oscillation quality while enabling contactless transmission.
Solution Approach 2:
The coupling loss reduction structure applies localized quality enhancement in specific regions where electromagnetic coupling occurs. By concentrating the loss reduction effect at critical coupling points (adjacent to contactless coupler components), it selectively improves quality factor where needed without compromising the overall contactless transmission functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances the quality factor of multi-die modules, ensuring compliance with noise performance and power consumption criteria by minimizing coupling losses and improving signal strength across various frequency ranges.
Implementation Method 1
contactless coupling options such as capacitive coupling and inductive coupling
Implementation Method 2
coupling loss reduction structures, such as cavities, magnetic materials, or redistribution layers
Data Source
AI summary
A multi-die module includes a first die with a first electronic device and a second die with a second electronic device. The multi-die module also includes a contactless coupler configured to convey signals between the first electronic device and the second electronic device. The multi-die module also includes a coupling loss reduction structure.