Multi-Die IC Configuration Data Decryption via Interposer
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Solution Overview
Problem
Multi-die integrated circuits face security issues due to the need for each die to access unencrypted configuration data securely, given the physical architecture of programmable ICs, where configuration data is highly confidential and must be decrypted for proper functionality.
Innovation Solution
A method for decrypting configuration data within a multi-die IC, where either a master die or each die includes decryption circuitry to decrypt received encrypted configuration data, with the decrypted data being distributed through an interposer to other dies, allowing secure and efficient configuration of each die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If configuration data is encrypted to prevent unauthorized access, then security is improved, but each die cannot access the configuration data for proper functionality
Solution Approach 1:
The configuration data is divided into multiple portions, with each die receiving only the portion it needs. The first die decrypts its portion and distributes encrypted portions to other dies, which then decrypt locally. This segmentation allows each die to have secure access to only its required configuration data while maintaining overall system security.
Solution Approach 2:
The first die acts as an intermediary that receives encrypted configuration data, decrypts it, and distributes the appropriate portions to other dies through the interposer. This intermediary approach enables secure data flow by performing decryption at a centralized point before distribution, resolving the conflict between security and accessibility.
2Ease of operation
If configuration data is distributed in unencrypted form to enable functionality, then ease of operation is improved, but security is compromised
Solution Approach 1:
Decryption is performed locally at each die rather than distributing unencrypted data across the entire system. The first die decrypts configuration data locally and distributes only the necessary encrypted portions to specific dies, which then perform local decryption. This ensures security is maintained while enabling local access to configuration data.
3Device complexity
If decryption is performed centrally in one die, then device complexity is reduced, but distribution time increases
Solution Approach 1:
The first die performs preliminary decryption of configuration data before distribution to other dies. By decrypting the data in advance and preparing it for distribution through the interposer, the system reduces the computational burden on individual dies while maintaining efficient configuration loading.
4Productivity
If each die has its own decryption circuitry, then productivity is improved through parallel decryption, but device complexity increases
Solution Approach 1:
The first die serves multiple functions: it decrypts its own configuration data, acts as a distribution hub for other dies, and manages the overall configuration process. This multi-functionality reduces the need for separate decryption circuitry in each die while maintaining efficient configuration loading across the multi-die system.
Data Source
AI summary
A method of loading configuration data within an integrated circuit that includes multiple dies is disclosed. The method can include receiving configuration data in encrypted form within a first die of the multiple dies of the integrated circuit and decrypting the configuration data within the first die to generate configuration data in unencrypted form. A portion of the configuration data in unencrypted form can be distributed from the first die to each other die of the multiple dies through an interposer to which each die is attached.