Multi-Die Interconnect Link Testing for Faster Defect Detection

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Solution Overview

Problem

Existing multi-die integrated circuit (IC) packages face challenges in efficiently testing die-to-die (D2D) links, which are crucial for achieving acceptable packaging costs, time, and yield, especially in three-dimensional configurations like memory cube architectures.

Innovation Solution

A testing method and apparatus are developed to test D2D links in multi-die packages using die interconnect circuits (DICs) with transmitter and receiver control circuits (TTCC and RTCC) and test access ports (TAPs) for conducting local and path tests, enabling simultaneous or sequential testing of transmitter and receiver cells, and defect detection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If comprehensive testing of all D2D links is performed, then reliability is improved, but testing time and complexity increase

Engineering Contradiction:

Improvedefect detection capabilityVSAvoidtesting time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The testing method segments the comprehensive D2D link testing into multiple independent test types: local Tx cell tests, local Rx cell tests, and Tx:Rx path tests. Each test type can be executed independently and in parallel, allowing comprehensive coverage without sequential time penalty. The segmentation enables selective testing based on detected defects, optimizing the balance between thoroughness and time consumption.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The method performs preliminary local Tx cell tests and local Rx cell tests before conducting the more time-consuming Tx:Rx path tests. By identifying defective cells early through local tests, the system can skip unnecessary path testing for obviously defective links, reducing overall testing time while maintaining reliability through the comprehensive test suite.

Inventive Principle:

Principle #10Preliminary action

2Measurement precision

If multiple test types are implemented, then measurement precision is improved, but device complexity increases

Engineering Contradiction:

Improvedefect detection accuracyVSAvoidtesting apparatus complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The testing apparatus is designed with multi-functional capability, where the same test infrastructure (TAPs, control circuits, and measurement systems) supports multiple test types including local Tx cell tests, local Rx cell tests, and Tx:Rx path tests. This universality allows a single apparatus to perform comprehensive testing without requiring separate dedicated equipment for each test type, managing complexity while maintaining precision.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent introduces test access ports (TAPs) and control circuits as intermediary components that facilitate communication between the testing apparatus and the multi-die package under test. These intermediaries simplify the interface and control mechanisms, making the complex testing process more manageable and the apparatus less complex while maintaining high measurement precision through coordinated control of multiple test types.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20260002982A1Methods and apparatuses for testing multi-die package inter-connect links

Publication Date: 2026.01.01 INTEL CORP

AI summary

In some embodiments, techniques for testing die to die interconnect links are provided.