Multi-Die Package Thermal Management with Heat Spreader
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Solution Overview
Problem
Current IC packaging technologies face challenges in achieving cost-effectiveness and optimal thermal performance for multiple integrated circuit dies, particularly in miniaturized and stacked configurations.
Innovation Solution
A method involving a heat spreader disposed on a printed circuit substrate with IC dies wire-bonded to both sides, utilizing thermal solder balls for ground plane functionality and allowing for additional die stacking, while using various materials like Ag, Ni/Au, or Ni/Pd for wire bonding and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple IC dies are packaged in stacked configurations for miniaturization, then the package size is reduced, but thermal performance deteriorates
Solution Approach 1:
The patent transitions from planar 2D packaging to 3D stacked packaging by placing multiple IC dies on opposite sides of a heat spreader and stacking them vertically. This dimensional change enables miniaturization while the heat spreader provides thermal management in the vertical dimension, resolving the contradiction between reduced package volume and maintained thermal performance.
Solution Approach 2:
The heat spreader acts as an intermediary component between multiple IC dies, providing thermal conduction pathways and grounding functionality. It mediates the thermal management challenge in stacked configurations by distributing heat from multiple dies on both sides, enabling compact packaging without sacrificing thermal performance.
2Productivity
If IC dies are attached to both sides of an interposer, then packaging density is improved, but manufacturing complexity increases
Solution Approach 1:
The heat spreader serves multiple functions simultaneously: it acts as a thermal management component, a grounding plane, and a mechanical support structure for mounting IC dies on both sides. This multi-functionality increases packaging density while avoiding the need for separate components, thereby reducing overall manufacturing complexity despite the stacked configuration.
3Temperature
If thermal management components are added to improve heat dissipation, then thermal performance is improved, but cost and device complexity increase
Solution Approach 1:
The heat spreader is designed to perform multiple functions: thermal conduction, electrical grounding, and mechanical support. By integrating these functions into a single component rather than using separate thermal management devices, the patent improves heat dissipation while minimizing increases in device complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a cost-effective and thermally efficient multi-die package with improved power dissipation and ground plane functionality, supporting high thermal performance and scalability for multiple IC dies.
Implementation Method 1
a heat spreader disposed on a printed circuit substrate. At least one integrated circuit die is disposed on a top side of the heat spreader and at least one other integrated circuit die is disposed on a bottom side of the heat spreader
Implementation Method 2
the dies are connected to the substrate by wire bonds
Implementation Method 3
Thermal solder balls are electrically connected to solderable pads of the heat spreader through the open holes of the substrate, so as to couple the heat spreader to function as a ground plane
Data Source
AI summary
A method of assembling a multi-die package is achieved. A heat spreader is disposed on a printed circuit substrate. At least one integrated circuit die is disposed on a top side of the heat spreader and at least one other integrated circuit die is disposed on a bottom side of the heat spreader wherein the dies are connected to the substrate by wire bonds. Thermal solder balls are electrically connected to solderable pads of the heat spreader through the open holes of the substrate, so as to couple the heat spreader to function as a ground plane. Some of the ground pads of the dies can be bonded onto the heat spreader and the others bonded onto the substrate. Alternatively, all of the dies could only be connected to the substrate by wire bonding, and not connected to the heat spreader.