Thermal Relaxation Block Layout in Multi-Die Semiconductor Packages
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Solution Overview
Problem
As electronic products are miniaturized, heat dissipation in semiconductor packages becomes a critical issue, particularly for multi-die packages, where the arrangement of dies and connecting elements affects data transmission speed and reliability.
Innovation Solution
A manufacturing process for semiconductor packages that includes a heat dissipating structure with a thermally conductive material applied over the package, featuring a thermal relaxation block that contacts the redistribution structure and is positioned beside top packages, establishing an efficient heat dissipation path through the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If electronic products are miniaturized to reduce size, then product dimensions are reduced, but heat dissipation becomes more difficult and thermal management becomes critical
Solution Approach 1:
The patent introduces a thermal relaxation block that extends vertically through multiple packaging layers, transforming heat dissipation from a two-dimensional surface problem to a three-dimensional volumetric solution. The block penetrates through the encapsulant and connects to the semiconductor die, creating a vertical heat transfer pathway that bypasses the limited lateral heat dissipation area in miniaturized packages.
Solution Approach 2:
The thermal relaxation block acts as an intermediary element between the heat-generating semiconductor die and the external environment. This intermediate structure provides a dedicated thermal conduction pathway, mediating the heat transfer process and enabling efficient heat removal from the confined space of miniaturized packages without requiring direct contact between the die and external heat sinks.
2Adaptability or versatility
If multiple dies are arranged in a compact package to increase functionality, then device capability is improved, but heat dissipation and data transmission reliability are compromised
Solution Approach 1:
The patent segments the heat dissipation function from the electrical interconnection function by introducing a dedicated thermal relaxation block. This segmentation allows the multi-die package to maintain compact electrical connections while providing a separate, specialized pathway for heat removal, thereby preserving both functionality and thermal management performance in multi-die configurations.
3Temperature
If a thermal relaxation block is added to improve heat dissipation, then thermal performance is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The thermal relaxation block is designed to serve multiple functions simultaneously: it provides thermal conduction from the die, acts as a mechanical anchor for the die, and can serve as a support structure for the encapsulant. This multi-functionality reduces the need for separate components and simplifies the overall package structure despite the added thermal management capability.
Solution Approach 2:
The patent merges the thermal relaxation block with the packaging structure by forming it as an integral part of the package assembly process. The block is positioned and secured during the same manufacturing steps used for die attachment and encapsulation, combining multiple functions into a single integrated component rather than adding separate thermal management hardware.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat dissipation, allowing semiconductor devices to operate at higher powers and improving thermal performance and reliability.
Implementation Method 1
a thermally conductive material applied over the package and featuring a thermal relaxation block that contacts the redistribution structure
Data Source
AI summary
Manufacturing method of semiconductor package includes following steps. Bottom package is provided. The bottom package includes a die and a redistribution structure electrically connected to die. A first top package and a second top package are disposed on a surface of the redistribution structure further away from the die. An underfill is formed into the space between the first and second top packages and between the first and second top packages and the bottom package. The underfill covers at least a side surface of the first top package and a side surface of the second top package. A hole is opened in the underfill within an area overlapping with the die between the side surface of the first top package and the side surface of the second top package. A thermally conductive block is formed in the hole by filling the hole with a thermally conductive material.