Multi-Die Temperature Control via Gate Driver Feedback
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Solution Overview
Problem
Multi-die power modules face non-uniform temperature distribution due to geometric and electrical parameter variations, leading to limited power dissipation and unequal aging of dies, which restricts their effectiveness.
Innovation Solution
A closed-loop temperature control method that compares the temperature of individual dies to a reference temperature, derived from internal gate resistor values, to adjust conducting times and balance temperatures across parallel dies without additional sensors, using pulse width modulation and temperature sensing through gate drivers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple dies are used in parallel to achieve high current rating, then the power handling capability is improved, but the temperature distribution becomes non-uniform causing the hottest die to limit total power dissipation
Solution Approach 1:
The patent implements a feedback control system that continuously monitors the temperature of each die through voltage measurements during non-conducting periods. The control device compares individual die temperatures with reference temperatures and adjusts the conducting time of each die accordingly, creating a closed-loop feedback mechanism that actively balances temperature distribution across parallel dies while maintaining high power handling capability
Solution Approach 2:
The patent dynamically adjusts the conducting time of each die based on real-time temperature conditions. By varying the duty cycle of each die individually through pulse width modulation, the system adapts to changing thermal conditions and load requirements, enabling optimal power distribution that prevents hot spots while maximizing overall power dissipation capacity
2Power
If multiple dies are used in parallel to achieve high current rating, then the current capacity is improved, but the aging becomes unequal reducing the effectiveness of parallel devices
Solution Approach 1:
The feedback control system monitors temperature conditions of each die and adjusts conducting time to equalize thermal stress exposure. By preventing any single die from operating at excessively high temperatures, the system ensures more uniform aging characteristics across all parallel dies, thereby improving overall reliability and extending module lifespan
Solution Approach 2:
The system performs preliminary temperature assessment during non-conducting periods before each conduction phase. By measuring voltage across die terminals when off-state, the control device predicts temperature conditions and proactively adjusts conducting time parameters, preventing thermal runaway and ensuring balanced aging before it occurs
3Measurement precision
If additional temperature sensors are added to each die for temperature control, then the temperature measurement precision is improved, but the device complexity and cost increase
Solution Approach 1:
The patent utilizes the existing gate driver circuitry and internal gate resistance of each die to perform temperature sensing. By measuring voltage across the die terminals during non-conducting periods, the system extracts temperature information from parameters already present in the power device structure, eliminating the need for separate temperature sensors and reducing overall device complexity
Solution Approach 2:
The control device performs multiple functions using the same hardware infrastructure: it drives the power switches and simultaneously measures temperature through voltage sensing during off-states. The gate driver circuit serves dual purposes of switching control and temperature monitoring, reducing component count and simplifying the overall system architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces local hot spot temperatures, increases the lifespan of multi-die power modules by balancing temperatures across parallel dies, and can be implemented independently of loading conditions and the number of dies, with a low-cost and simple integration into existing gate drivers.
Implementation Method 1
the signal that is representative of the temperature of one die among the dies of the multi-die power module and the signal that is representative of the reference temperature are obtained by providing a current to the gate of the die and to the gates of the dies
Implementation Method 2
reducing the duration of the conducting time of the die or reducing the duration of the conducting time of the other dies of the multi-die power module according to the comparison result
Data Source
AI summary
The present invention concerns a method for controlling the temperature of a multi-die power module, a multi-die temperature control device. The multi-die temperature control: obtains a signal that is representative of the temperature of one die among the dies of the multi-die power module when the die is not conducting, obtains signals that are representative of a reference temperature that is dependent of the temperature of all the dies of the multi-die power module when the dies are not conducting, compares the signal that is representative of the temperature of one die to the signal that is representative of the reference temperature, reduces the duration of the conducting time of the die or reducing the duration of the conducting time of the other dies of the multi-die power module according to the comparison result.