Multidimensional Heat Transfer System for Electronic Components
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Solution Overview
Problem
Current heat transfer systems for electronic components are either too large for miniaturized devices or fail to provide adequate cooling performance, particularly in three-dimensional integrated circuits where heat is concentrated in a smaller space.
Innovation Solution
A heat transfer system comprising a cold core, solid state cooling devices, and heat sinks, with optional air movers and liquid conduits to facilitate cooling, allowing for efficient heat dissipation to sub-ambient temperatures by utilizing thermoelectric modules and heat sinks with embedded pipes for fluid circulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If existing cooling systems are used to cool electronic components, then cooling function is provided, but the system size becomes too large for miniaturized devices
Solution Approach 1:
The cold core is positioned within or adjacent to the electronic component package, with solid state cooling devices nested between the cold core and heat sinks. This nested arrangement allows the cooling system to be integrated into the existing device footprint rather than adding external cooling volume.
Solution Approach 2:
The patent transitions from two-dimensional planar cooling to three-dimensional volumetric cooling by stacking multiple cold cores, solid state cooling devices, and heat sinks in vertical layers. This enables efficient heat dissipation from concentrated heat sources in 3D integrated circuits while maintaining a compact overall form factor.
2Volume of moving object
If cooling systems are reduced in size for miniaturized devices, then system size decreases, but cooling performance becomes insufficient
Solution Approach 1:
Liquid conduits are integrated to circulate cooling fluid through the heat sinks and cold cores, enabling highly efficient heat transfer in a compact volume. The fluid circulation system provides superior cooling performance compared to air-based systems while occupying minimal space.
Solution Approach 2:
The system employs multiple materials with different thermal properties - highly conductive materials for cold cores and heat sinks, and thermoelectric materials for solid state cooling devices. This composite approach maximizes cooling efficiency within the constrained volume by optimizing heat transfer at each interface.
3Productivity
If three-dimensional integrated circuits are used to increase component density, then functionality increases, but heat concentration in smaller space worsens cooling requirements
Solution Approach 1:
The cooling system is segmented into multiple discrete layers - cold cores positioned at heat source locations, solid state cooling devices in intermediate layers, and heat sinks distributed throughout the 3D structure. This segmentation allows heat to be extracted at multiple points throughout the volume rather than concentrating thermal management at a single location.
Solution Approach 2:
Solid state cooling devices act as intermediary elements between the cold cores and heat sinks, providing active thermoelectric cooling in the intermediate zone. These devices bridge the thermal gap and enable progressive heat extraction as thermal energy moves from the electronic components through the cooling system layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively cools electronic components to sub-ambient temperatures, addressing the challenge of heat concentration in miniaturized devices by optimizing heat transfer through thermal communication and fluid circulation, enhancing cooling performance in constrained spaces.
Implementation Method 1
A heat transfer system comprising a cold core, solid state cooling devices, and heat sinks, with optional air movers and liquid conduits to facilitate cooling, allowing for efficient heat dissipation to sub-ambient temperatures by utilizing thermoelectric modules
Implementation Method 2
one or more liquid conduits for facilitating the flow of a cooling fluid through a substantially closed circuit that extends between the secondary cold core and one or more of the primary heat sinks
Implementation Method 3
a plurality of heat sinks each in thermal communication with one of the plurality of solid state cooling devices
Implementation Method 4
an air mover and/or a duct, positioned to direct at least a portion of the flow of air adjacent one or more of the plurality of heat sinks
Data Source
AI summary
Devices, methods, and systems for facilitating heat transfer and cooling electronic components are presented. A system for cooling an electronic component includes a cold core, a plurality of solid state cooling devices, and a plurality of heat sinks. The cold core may define one or more cavities for receiving electronic components. The system may include an air mover and a duct. In operation, the system may cool an electronic component to sub-ambient temperatures. In other embodiments, the system may include multiple cold cores connected by liquid conduits for facilitating a flow of a cooling fluid.