Multi-Directional Chip Guard Layout for 3D Memory Reliability

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Solution Overview

Problem

The operational reliability of three-dimensional semiconductor devices deteriorates as the number of stacked memory cells increases, necessitating improved structural design to enhance integration and reliability.

Innovation Solution

A semiconductor device with a substrate featuring a cell region surrounded by a chip guard region, including multiple chip guards extending in different directions, and guard patterns connected by guard pads, which are spaced apart to provide structural support and enhance environmental reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the stacked number of memory cells is increased to improve integration, then the area occupied by memory cells per unit area is reduced, but the operational reliability deteriorates

Engineering Contradiction:

Improvearea occupied by memory cells per unit areaVSAvoidoperational reliability

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

The chip guard region is divided into multiple segments with first, second and third chip guards extending in different directions. These segmented guard structures are spaced apart to create a modular protection system that provides structural support without compromising reliability as memory cell stacking increases

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Chip guards extend in multiple directions (first direction, second direction intersecting the first direction) rather than a single linear arrangement. This multi-dimensional configuration provides comprehensive structural support across the substrate, enhancing reliability in three-dimensional semiconductor devices with increased memory cell stacking

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Strength

If chip guards are placed close together to provide continuous protection, then structural support is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvestructural supportVSAvoidchip guard configuration

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

Instead of providing continuous chip guard coverage across the entire chip guard region, the patent uses spaced-apart chip guards that provide partial protection. This partial action approach maintains sufficient structural support while significantly reducing manufacturing complexity and the number of guard structures required

Inventive Principle:

Principle #16Partial or excessive action

Data Source

PatentUS12438125B2Semiconductor device with multi-directional chip guards

Publication Date: 2025.10.07 SK HYNIX INC

AI summary

A semiconductor device includes: a substrate with a cell region and a chip guard region, the chip guard region surrounding the cell region; a first chip guard extending over the chip guard region in a first direction; a second chip guard extending over the chip guard region in the first direction, the second chip guard being spaced apart from the first chip guard; and a third chip guard extending over the chip guard region in a second direction, the second direction intersecting the first direction. The first chip guard includes a first end portion, the second chip guard includes a second end portion, and the third chip guard includes a third end portion that is disposed between the first end portion and the second end portion.