Multidirectional Configurable Multi-Processor Architecture
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Solution Overview
Problem
Traditional multi-processor systems face challenges in serviceability, configurability, and cooling due to complex and inflexible chassis designs, which limit the ability to add function cards and maintain hardware reliability, especially in high-end systems where airflow and component accessibility are compromised by blockages and predetermined structural constraints.
Innovation Solution
A multidirectional configurable architecture featuring a bottom plane with edge-to-edge connections between processor boards and function boards, allowing for vertical configuration of function cards and strategic placement of fans to optimize airflow, along with serviceable and configurable components, such as slide trays and modular connections, to enhance flexibility and cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional electronic enclosure design with complex internal chassis is used, then mechanical support for electronic components is provided, but serviceability and configurability are reduced due to blockages and predetermined structural constraints
Solution Approach 1:
The system is divided into multiple independent subsystem boards (processor boards, I/O boards, expansion boards) that can be independently accessed and serviced. Each board can be removed and replaced without affecting the entire system, enabling front-side serviceability while maintaining hardware reliability through modular design.
Solution Approach 2:
The patent introduces a vertical dimension to the traditional horizontal chassis layout by stacking processor boards vertically above the I/O board. This vertical stacking allows airflow to pass through horizontal channels without being blocked by power supplies or other components, improving cooling efficiency while maintaining serviceability through front-side access.
2Adaptability or versatility
If more subsystem boards are divided to increase system flexibility, then configurability improves, but cooling performance deteriorates due to blockages from additional components
Solution Approach 1:
The patent resolves the cooling-blockage problem by transitioning from a horizontal layout to a vertical stacking architecture. Processor boards are stacked vertically above the I/O board, creating horizontal airflow channels that are not blocked by power supplies or expansion cards. This allows multiple subsystem boards to be configured while maintaining effective cooling through unrestricted airflow paths.
Solution Approach 2:
The system allows dynamic configuration of function cards on the I/O board and expansion boards without requiring physical reconfiguration of the entire chassis. The modular design enables hot-swapping of cards while the system remains operational, providing adaptability without compromising the fixed cooling architecture.
3Temperature
If power supply is placed at lower portion to generate airflow, then cooling is provided, but airflow rate is reduced due to blockage by power supply itself
Solution Approach 1:
The patent repositions the power supply vertically below the I/O board rather than placing it horizontally within the main airflow path. This vertical placement creates unobstructed horizontal airflow channels between the processor boards and the front panel, allowing high-volume airflow to reach the processors without being blocked by the power supply or its associated fans.
4Reliability
If center interconnecting plane is designed for board-to-board connection, then system connectivity is achieved, but field serviceability is lost due to inaccessibility in assembled chassis
Solution Approach 1:
The system uses standardized edge connectors on the I/O board that interface with processor boards through vertical slots. This segmentation allows the processor boards to be independently removed and replaced at the front panel without requiring access to the center interconnecting plane, enabling field serviceability while maintaining reliable board-to-board connectivity through the standardized connector interfaces.
Data Source
AI summary
A physical hardware architecture is provided to fulfill flexibility, serviceability and configurability of a multi-processor system. The architecture mainly includes a bottom plane, plural processor boards and a function board. On the front section of the top side of the bottom plane, the processor boards are configured thereon. The function board faces downwards and is configured in an edge-to-edge connection with the front edge of the bottom plane. Function card(s) may be configured vertically on the bottom surface of the function board. On the rear section of the top side of the bottom plane expansion card(s) are configured vertically. With main system fan(s) located on the top of the function board and auxiliary system fan configured under the bottom plane, the multi-processor system will also achieve optimum cooling capability through the architecture.