Multidirectional Electrode Segments via Laser Ablation
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Solution Overview
Problem
Current methods for manufacturing multidirectional electrodes, such as those using High-Temperature-Cofired-Ceramics (HTCC), face limitations in miniaturization, leading to a need for smaller electrode sizes and higher integration densities of conductor structures.
Innovation Solution
A method involving an electrically insulating ceramic substrate with a conductor track, where a continuous metal layer is applied and partially removed using laser ablation to form electrode segments, allowing for precise control over conductor track geometry and spacing, including angled portions and depressions in the substrate for enhanced miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If HTCC method with high temperature sintering is used, then conductor structures with small dimensions are obtained, but further miniaturization is limited
Solution Approach 1:
The electrode structure is divided into multiple segments arranged in a multidirectional pattern, allowing each segment to be independently optimized for size and position. This segmentation enables further miniaturization while maintaining functional integrity, overcoming the limitations of conventional monolithic electrode designs manufactured by HTCC.
Solution Approach 2:
The invention transitions from planar conductor tracks to three-dimensional multidirectional electrode segments positioned at different heights and angles. By utilizing vertical stacking and angular arrangements, the design achieves higher integration density and smaller footprint without being constrained by the two-dimensional limitations of traditional sintering processes.
2Volume of moving object
If conductor track dimensions are reduced, then electrode size decreases, but manufacturing complexity increases
Solution Approach 1:
Multiple electrode segments are combined within a single compact structure, with each segment serving distinct functional purposes. This merging approach achieves high integration density and small overall electrode size while managing complexity through functional integration rather than proliferation of separate components.
Solution Approach 2:
Electrode segments are arranged in a nested or stacked configuration where smaller segments are positioned within or between larger structural elements. This nesting strategy enables miniaturization by efficiently utilizing three-dimensional space, reducing the overall electrode volume while maintaining the necessary conductor structures.
3Quantity of substance
If integration density of conductor structures is increased, then electrode functionality improves, but manufacturing precision requirements increase
Solution Approach 1:
Different regions of the electrode structure are assigned different properties and functions. Electrode segments at different positions and orientations are optimized for their specific roles, with conductor dimensions, materials, and configurations tailored to local requirements. This local optimization enables high integration density while maintaining manufacturability, as each segment can be produced with appropriate precision levels for its specific function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of medical electrodes with significantly smaller feature sizes and higher integration densities, improving the stability and resilience of conductor structures while allowing for flexible arrangement of electrode segments.
Implementation Method 1
the partial removal of the metal layer comprises laser ablation
Data Source
AI summary
One aspect relates to a method for manufacturing a medical electrode, including providing an electrically insulating substrate material, on which a conductor track is arranged; applying a continuous metal layer, which at least partially covers the substrate material, and the conductor track, so that an electrically conducting connection is formed between the metal layer and the conductor track; and partially removing the metal layer to form an electrode segment, which has an electrically conducting connection to the conductor track.