Multi-Directional Waveguide Layout for Shorter Optical Signal Paths
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Solution Overview
Problem
Current photonic components face challenges in packaging multiple optical fibers, leading to longer transmission paths that adversely affect optical communication efficiency.
Innovation Solution
An optoelectronic device with multiple first and second waveguides extending in different directions, optically coupled with optoelectronic modules, allows for concurrent processing of divided optical signals, enhancing communication efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple photonic components and optical fibers are connected, then optical signal transmission is enabled, but the transmission path length increases and packaging becomes challenging
Solution Approach 1:
The patent transitions from planar waveguide routing to three-dimensional vertical integration. Multiple waveguides are stacked in different layers and connected via vertical coupling structures, enabling optical signals to transmit through the third dimension (vertical direction) rather than only in-plane. This dimensional change shortens the transmission path while accommodating multiple photonic components in a compact footprint.
Solution Approach 2:
The patent implements nested integration by placing multiple waveguides and photonic components in a hierarchical structure. Waveguides are embedded within layers that are stacked and coupled vertically, creating a nested configuration where components in upper layers are optically connected to components in lower layers through vertical coupling structures, thereby reducing overall transmission path length.
2Productivity
If multiple photonic components are packaged together, then optical communication capacity increases, but packaging complexity increases
Solution Approach 1:
The patent divides the optical communication system into segmented functional layers, with each layer containing specific waveguides and photonic components. This segmentation allows independent design, fabrication, and testing of each layer before integration, reducing overall packaging complexity while enabling high optical communication capacity through multi-layer concurrent operations.
Solution Approach 2:
The patent designs universal coupling structures that can optically connect waveguides across different layers and accommodate multiple photonic components. These standardized coupling mechanisms provide multi-functional interfaces that simplify the integration process and reduce packaging complexity while supporting high-capacity optical communication through multiple concurrent channels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enables efficient transmission and processing of multiple optical signals concurrently, reducing transmission path length and improving communication performance.
Implementation Method 1
The plurality of first waveguides are configured to receive a first plurality of optical signals. The plurality of second waveguides are configured to transmit a second plurality of optical signals.
Data Source
AI summary
An optoelectronic device is provided. The optoelectronic device includes a plurality of first waveguides and a plurality of second waveguides. The plurality of first waveguides are configured to receive a first plurality of optical signals. The plurality of second waveguides are configured to transmit a second plurality of optical signals. The plurality of first waveguides extend substantially along a first direction and the plurality of second waveguides extend substantially along a second direction different from and non-parallel with the first direction.