Multi-Fingered Board for Accurate Temperature Measurement

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Solution Overview

Problem

Temperature measurements in test boxes for calibrating optoelectronic devices are often inaccurate due to air flow penetration, which affects the calibration of internal temperature sensors in optical transceivers.

Innovation Solution

The use of a multi-fingered board with partially thermally isolated temperature sensors that are thermally coupled to the devices, minimizing the impact of air flow and providing accurate temperature measurements for both air and device temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If temperature sensors are exposed to air flow in the test box, then air temperature can be measured, but measurement precision deteriorates due to air flow penetration affecting sensor readings

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidair flow interference
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a thermal coupling mechanism as an intermediary between the temperature sensor and the device under test. This thermal coupling path allows the sensor to measure device temperature accurately without being directly exposed to air flow, thereby resolving the contradiction between measurement precision and air flow interference.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent segments the temperature measurement function into two independent parts: air temperature sensing and device temperature sensing. By using separate sensors with different exposure conditions, the system can accurately measure both temperatures without air flow interfering with the device temperature readings.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If temperature sensors are thermally coupled to devices, then device temperature measurement precision improves, but device complexity increases due to additional thermal coupling structures

Engineering Contradiction:
Improvedevice temperature measurement accuracyVSAvoidthermal coupling structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent employs thin film thermal coupling structures that provide effective thermal contact between the sensor and device without adding significant mechanical complexity. The thin film approach maintains measurement precision while minimizing the increase in device complexity.

Inventive Principle:
Principle #30Flexible shells and thin films

3Temperature

If air flow is used for temperature regulation in the test box, then temperature control effectiveness improves, but measurement precision deteriorates due to air flow penetration through the test box

Engineering Contradiction:
Improvetemperature control effectivenessVSAvoidtemperature sensor accuracy
Core Design Contradiction:
TemperatureVSMeasurement precision

Solution Approach 1:

The patent uses thermal coupling as an intermediary mechanism that decouples the temperature sensing function from the air flow environment. This allows the test box to maintain effective temperature control through air flow while the thermally coupled sensors measure device temperature accurately without air flow interference.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent segments the temperature measurement function from the air flow control function. By using separate thermal coupling paths for different sensors, the system can optimize air flow for temperature control while maintaining accurate device temperature measurements independent of air flow conditions.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures reliable temperature measurements and improved calibration of optoelectronic devices by reducing the interference of air flow, leading to more precise adjustments of laser bias currents and reduced transmission errors.

Implementation Method 1

Each of the first and second temperature sensors comprises a partially thermally isolated temperature sensor

Methodology Applied
Scientific EffectThermal isolation: Thermal Insulation

Implementation Method 2

The board is coupled to the cover and comprises one or more fingers and a plurality of partially thermally isolated temperature sensors. When the cover is closed and one or more devices are received in the one or more test slots, one or more of the plurality of partially thermally isolated temperature sensors are thermally coupled to the one or more devices.

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8104950B2Avoiding air flow penetration in temperature measurement
Publication Date: 2012.01.31 II VI DELAWARE INC
  • US8104950B2 patent drawing
  • US8104950B2 patent drawing
  • US8104950B2 patent drawing

AI summary

In one example embodiment, a board for measuring device temperatures comprises a base and one or more fingers extending from the base. The base and the one or more fingers comprise a flexible material. One or more first temperature sensors are disposed on the one or more fingers. One or more second temperature sensors are disposed on the base. Each of the first and second temperature sensors comprises a partially thermally isolated temperature sensor.