Multi-function Miniaturized SMD Packaging Without Lead Frames
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Solution Overview
Problem
Existing lead-frame-based packaging methods are inadequate for miniaturized surface-mount devices (SMDs), leading to inaccurate installation and functional inferiority or inactivity, and multilayer technology combinations of devices with different sintering temperatures and contraction coefficients often result in loose packaging and invalidity.
Innovation Solution
The use of circuit boards instead of lead frames for packaging miniaturized SMDs, with a process involving a die module, lower and upper circuit boards, encapsulant, and outer electrodes, all connected using lead-free conductive paste, eliminating the need for external pins and conventional lead frames.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If lead-frame-based packaging is used for miniaturized SMDs, then conventional packaging structure is maintained, but installation accuracy deteriorates and device functionality becomes inferior or inactive
Solution Approach 1:
The patent extracts and removes the lead frame from the packaging structure, replacing it with a substrate that integrates the packaging function directly into the circuit board. This eliminates the lead frame's interference with miniaturized die installation while maintaining electrical connectivity and mechanical support functions.
Solution Approach 2:
The patent merges the packaging function with the circuit board substrate, combining what were previously separate components (lead frame and substrate) into a unified structure. The substrate simultaneously provides mechanical support, electrical connectivity, and packaging enclosure for the miniaturized die.
2Adaptability or versatility
If devices with different sintering temperatures and contraction coefficients are combined through multilayer technology, then functional integration is achieved, but packaging becomes loose and devices become invalid
Solution Approach 1:
The patent changes the material parameters of the substrate to match those of the miniaturized die, specifically selecting materials with compatible sintering temperatures and contraction coefficients. This ensures that during the sintering process, both the substrate and die undergo similar dimensional changes, preventing packaging loosening while maintaining functional integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures accurate and reliable packaging of miniaturized SMDs, reducing costs, simplifying the process, minimizing component count, and effectively reducing layout wire length and noise, while enabling the integration of multiple functions in a single-piece device.
Implementation Method 1
The disclosed process for producing the multi-function miniaturized SMD is free from use of lead-containing tin paste
Data Source
AI summary
A surface-mount device (SMD) uses no conventional lead frame and contains a multi-function die module formed from either a single die or two or more dies electrically connected in series, in parallel, or in any combination of series and parallel, to provide such a SMD having one or more different functions including wave filtration, rectification, surge protection, sensing, current limiting, voltage regulation or prevention from voltage backflow, as compared to the prior art, the SMD disclosed is formed from fewer components, is simpler to manufacture and more effectively reduce layout wire length and noise.