Multifunctional Substrate Polishing Device with Integrated Grinding
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Solution Overview
Problem
Conventional grinding and polishing processes for hard and brittle materials like silicon wafers and glass substrates face challenges such as substrate deformation and breakage during transfer between machines, leading to low production efficiency and high equipment costs due to the need for dedicated machines for each process step.
Innovation Solution
A multifunction substrate grinding and polishing device with a double-spindle structure allows for integrated grinding and polishing in a single setup, using axial, radial, and back grinding and polishing methods, with counterweighting spindles and shared motor-driven feed mechanisms to minimize deformation and equipment requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrate thinning processing is performed using dedicated grinding and polishing machines separately, then surface planarization and polishing quality can be achieved, but substrate deformation and breakage occur during transfer between machines
Solution Approach 1:
The patent combines grinding and polishing functions into a single integrated machine tool with a unified workbench. The substrate remains clamped on the same workbench throughout both grinding and polishing operations, eliminating the need to transfer the substrate between separate machines and thus preventing deformation and breakage during transfer.
Solution Approach 2:
The machine tool is designed with multi-functionality to perform both grinding and polishing operations. It includes a grinding device with grinding wheel and a polishing device with polishing wheel, both capable of processing the substrate on the same workbench, making the machine universal for different processing requirements.
2Adaptability or versatility
If dedicated grinding and polishing machines are used separately, then specialized processing functions are achieved, but equipment investment increases and production efficiency decreases
Solution Approach 1:
The patent merges grinding and polishing machines into one integrated device, reducing equipment investment while improving productivity. The unified machine allows continuous processing without substrate transfer, eliminating idle time and increasing production efficiency.
Solution Approach 2:
The machine tool achieves versatility through its dual capability to perform both grinding and polishing. The workbench can accommodate different processing configurations, and the system can adapt to various substrate types and processing requirements, maintaining specialization while improving efficiency.
3Ease of manufacture
If substrate is removed from grinding machine and re-clamped to polishing machine, then grinding and polishing can be performed separately, but processing time increases and substrate breakage risk increases
Solution Approach 1:
The patent combines grinding and polishing into a continuous process on a single workbench. The substrate is clamped once and processed sequentially through grinding and polishing without removal or re-clamping, significantly reducing processing cycle time and eliminating breakage risks associated with transfer operations.
4Adaptability or versatility
If conventional separate grinding and polishing processes are used, then each process can be optimized independently, but overall process complexity and equipment requirements increase
Solution Approach 1:
The patent integrates grinding and polishing systems into a unified machine structure with shared components such as the workbench, control system, and support infrastructure. This reduces overall equipment complexity while maintaining the ability to optimize each process independently through separate device parameters and settings.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances precision, automation, reduces substrate breakage, and improves production efficiency by allowing all processing steps to be completed in a single clamping operation, reducing equipment investment and fragmentation.
Implementation Method 1
Grinding and lapping tools are used for the surface planarization processing of the substrate... Polishing tools are used for surface polishing of the substrate to remove the substrate grinding and lapping surface damage layer
Data Source
AI summary
A substrate grinding and polishing device comprising separate grinding and polishing units for operating on a work-piece. The work piece is clamped to a rotating work table under the units and a track underneath the rotating work table allows for quick transfer from the grinding unit to the polishing unit or vice versa. This setup allows for easy transfer as well as quick adjustment between different modes of grinding and polishing.