Multi-Gauge Clip Interconnect for Non-Coplanar Dual-Side Cooling
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Solution Overview
Problem
Current semiconductor device packages face challenges in efficient heat dissipation on multiple surfaces, particularly where the contact surface of a signal lead is not coplanar with the semiconductor die, limiting effective cooling and electrical access.
Innovation Solution
A packaged semiconductor device apparatus featuring a conductive paddle, a semiconductor die, and a conductive clip with varying thicknesses, encapsulated in a molding compound, allowing for dual-sided cooling and electrical coupling with a signal lead, even in non-coplanar configurations, using a multi-gauge conductive clip and paddle for enhanced heat dissipation and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional semiconductor device package structure is used, then manufacturing is simpler, but heat dissipation efficiency on multiple surfaces is reduced
Solution Approach 1:
The package structure is segmented into distinct functional zones: a first surface with a first pad for heat dissipation, a second surface with a second pad for heat dissipation, and side surfaces with conductive clips for electrical connection. This segmentation allows each surface to be optimized for its specific function, enabling efficient multi-surface heat dissipation while maintaining manageable structural complexity through modular design.
Solution Approach 2:
The invention transitions from conventional single-surface or dual-surface heat dissipation to multi-surface heat dissipation by utilizing top, bottom, and side surfaces of the package. This dimensional expansion creates additional thermal pathways, significantly improving heat dissipation efficiency while the standardized multi-surface architecture keeps the overall structure manageable.
2Adaptability or versatility
If the contact surface of a signal lead is made coplanar with the semiconductor die surface, then electrical coupling is simpler, but adaptability to non-coplanar configurations is lost
Solution Approach 1:
Conductive clips serve as intermediary elements between the semiconductor die and signal leads. These clips can be positioned on side surfaces and extend to connect with signal leads at different planes, mediating the connection between non-coplanar surfaces. This intermediary approach enables compatibility with non-coplanar configurations while maintaining relatively simple interconnection structures through the use of these flexible conductive elements.
3Temperature
If multiple surfaces are used for heat dissipation, then cooling efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
Each surface of the package is equipped with localized thermal management features: pads on the top and bottom surfaces, and conductive clips on side surfaces. This local quality approach allows each surface to be independently optimized for its thermal function without requiring high precision alignment between surfaces, as each local feature performs its specific thermal role independently. This reduces manufacturing precision requirements while maintaining effective multi-surface cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient dual-sided cooling and electrical access to semiconductor dies in packages with non-coplanar configurations, improving performance and reducing overheating risks while maintaining compatibility with diverse package assemblies.
Implementation Method 1
conductive paddle, a semiconductor die coupled with the conductive paddle and a conductive clip
Data Source
AI summary
In a general aspect, a packaged semiconductor device apparatus a conductive paddle, a semiconductor die coupled with the conductive paddle and a conductive clip having a first portion with a first thickness and a second portion with a second thickness. The first thickness can be greater than the second thickness. The first portion can be coupled with the semiconductor die. The device can also include a molding compound encapsulating the semiconductor die and at least partially encapsulating the conductive paddle and the conductive clip. The device can further include a signal lead that is at least partially encapsulated in the molding compound, the second portion of the conductive clip being coupled with the signal lead.