Multilayer Antenna Ground Segmentation for Sensitivity
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Solution Overview
Problem
As electronic devices are downsized, the size constraint on antenna devices leads to a degradation of antenna sensitivity, and sharing a ground with other circuits further reduces this sensitivity.
Innovation Solution
The antenna device employs a multilayer substrate configuration with dielectric substrates, including a ground upper layer, inner layer, and lower layer substrates, where the first and third ground parts are electrically connected, and the second and fourth ground parts are connected, along with a chip antenna and adjustment components to maintain high sensitivity, while isolating the antenna ground from other circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna device size is reduced to meet electronic device downsizing, then the electronic device size is reduced, but the antenna sensitivity degrades
Solution Approach 1:
The patent transitions from a planar antenna structure to a three-dimensional multilayer substrate configuration. By stacking multiple ground layers (first ground part, second ground part, third ground part, fourth ground part) at different vertical levels and electrically connecting them, the antenna device achieves enhanced sensitivity within a compact volume. This vertical dimensionality allows the antenna to maintain performance while reducing the horizontal footprint in the electronic device.
Solution Approach 2:
The patent employs a composite structure combining multiple dielectric substrates with different ground patterns and conductive connections. The multilayer substrate system integrates various materials and configurations (different ground part arrangements, conductive vias, and dielectric layers) to create an antenna structure that achieves high sensitivity in a small form factor, resolving the contradiction between size reduction and sensitivity maintenance.
2Device complexity
If a shared ground is used for antenna and other circuits, then the device complexity is reduced, but the antenna sensitivity degrades
Solution Approach 1:
The patent divides the ground structure into multiple separate ground parts (first ground part, second ground part, third ground part, fourth ground part) located on different layers and positions. These segmented ground parts are electrically connected through conductive vias and connections, creating a distributed ground system that isolates the antenna ground from other circuit grounds. This segmentation prevents ground interference while maintaining a relatively simple overall structure.
Solution Approach 2:
The patent resolves the ground sharing issue by utilizing the vertical dimension through multilayer substrates. Instead of competing for the same planar ground space, the antenna ground structure is distributed across multiple vertical layers, with conductive connections establishing electrical continuity. This vertical separation allows the antenna to have its dedicated ground path without requiring a complex lateral ground isolation scheme.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains high antenna sensitivity even in small electronic devices, improving gain and reception sensitivity by adjusting antenna characteristics and isolating the antenna ground from other circuits.
Implementation Method 1
a chip antenna disposed on the ground upper layer substrate, transmitting and receiving an electromagnetic wave
Implementation Method 2
an adjustment component electrically connecting the first ground part and the second ground part, and adjusting an antenna characteristic
Data Source
AI summary
An antenna device includes: a ground upper layer substrate of a dielectric substrate forming a first ground part and a second ground part disposed at a predetermined distance from the first ground part; a ground lower layer substrate of a dielectric substrate forming a third ground part and a fourth ground part disposed at a predetermined distance from the third ground part; and an inner layer substrate of a dielectric substrate forming a fifth ground part. The ground upper layer substrate, inner layer substrate, and lower layer substrate are laminated. The first ground part and third ground part are electrically connected. The second ground part and fourth ground part are electrically connected. The antenna device further includes: a chip antenna disposed on the ground upper layer substrate, transmitting and receiving electromagnetic waves; and an adjustment component electrically connecting the first ground part and second ground part, and adjusting antenna characteristics.