Multilayer Antenna Module With Stepped Ground for mmWave Efficiency
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Solution Overview
Problem
In electronic devices operating in the millimeter wave band, antenna radiation efficiency is reduced, and feeding loss is increased when antenna elements are arranged on a multilayer substrate.
Innovation Solution
The electronic device incorporates a multilayer substrate with a stepped ground structure, where the lower patch is electrically connected to the upper ground at offset points, and the upper patch is spaced apart from the lower patch, optimizing the ground shape and feeding structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If antenna elements are arranged on a multilayer substrate, then device integration is improved, but antenna radiation efficiency is reduced
Solution Approach 1:
The ground layer is segmented into multiple ground layers at different heights above the lower patch, creating a stepped ground structure. This segmentation allows the antenna elements to maintain proper spacing and radiation characteristics while still being integrated on a compact multilayer substrate, thereby resolving the contradiction between device integration and radiation efficiency.
Solution Approach 2:
The patent introduces a vertical dimension by creating ground layers at different heights (first ground layer above lower patch, second ground layer above first ground layer). This three-dimensional ground structure allows the antenna to achieve better radiation efficiency by controlling electromagnetic field distribution in the vertical direction, while maintaining compact horizontal footprint for device integration.
2Volume of stationary object
If antenna elements are arranged on a multilayer substrate, then substrate size reduction is achieved, but feeding loss is increased
Solution Approach 1:
The patent applies different ground layer configurations at different locations: the first ground layer is positioned closer to the lower patch in feeding regions to reduce feeding loss, while the second ground layer provides additional grounding in radiation regions to improve radiation efficiency. This local optimization resolves the contradiction between compact substrate size and feeding loss reduction.
Solution Approach 2:
By introducing vertical stacking of ground layers, the patent reduces the horizontal substrate footprint while maintaining adequate grounding and feeding paths. The multi-level ground structure provides multiple grounding paths that reduce current path length and associated losses, thereby reducing feeding loss while keeping the substrate compact.
Data Source
AI summary
Provided is an electronic device having a multilayer substrate according to an embodiment. The electronic device may include a multilayer substrate on which an antenna is disposed and which includes a front layer, a back layer, a plurality of middle layers, and a plurality of ground layers. The antenna may include a lower patch that is disposed on a layer different from an upper ground among the plurality of ground layers and is electrically connected to the upper ground at a plurality of offset points; and an upper patch disposed spaced apart from the lower patch by a predetermined distance.