Multilayer Vertically Integrated Array for Low ESL Decoupling
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Solution Overview
Problem
Current multilayer decoupling capacitors face challenges in achieving high packing density, efficient signal filtering, and transient suppression while maintaining low equivalent series inductance (ESL) and equivalent series resistance (ESR) with configurable capacitance and voltage clamping values, especially in integrated circuit environments.
Innovation Solution
A multilayer vertically integrated array with interdigitated electrode configurations and a land grid array packaging configuration, featuring electrode layers with exposed tabs for termination and encasing material that can be dielectric or varistor material, allowing for configurable electrical characteristics and transient overvoltage suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If component size is reduced to increase packing density, then area occupied by each component decreases, but manufacturing precision and reliability become more difficult to maintain
Solution Approach 1:
The patent transitions from planar capacitor layouts to vertically stacked multilayer structures. By stacking multiple capacitor layers in the vertical dimension, the component achieves increased capacitance and functionality without increasing its footprint area, thereby maintaining small component size while enabling complex electrical characteristics that would be difficult to manufacture in planar configurations.
Solution Approach 2:
The patent embeds multiple functional elements within a compact vertical structure. Multiple electrode pairs, dielectric layers, and varistor elements are nested within each other in the vertical stack, allowing multiple电容 values and filtering functions to be integrated in a single small component without requiring larger area.
2Area of stationary object
If component size is reduced to increase packing density, then area occupied by each component decreases, but transient suppression capability and filtering performance deteriorate
Solution Approach 1:
The patent combines decoupling capacitor functionality with transient voltage suppression in a single integrated component. Varistor materials are incorporated into the vertical stack alongside capacitor electrodes and dielectric layers, enabling the small component to provide both high-frequency decoupling and overvoltage protection that would traditionally require separate larger components.
Solution Approach 2:
The patent uses composite material structures combining different dielectric materials and varistor materials in the vertical stack. This allows the component to exhibit multiple electrical characteristics simultaneously - capacitance for decoupling and non-linear voltage-dependent resistance for transient suppression - maintaining reliable performance in a compact form.
3Ease of operation
If conventional termination schemes with long traces are used, then ease of connection is improved, but equivalent series inductance increases
Solution Approach 1:
The patent brings multiple electrode tabs to the same vertical level through the stacked structure, enabling short trace connections on the circuit board. Instead of requiring long traces from components at different locations, the vertical integration allows multiple connection points to be accessed closely together, reducing trace length and associated inductance while maintaining ease of connection.
Solution Approach 2:
The patent segments the capacitor into multiple electrode pairs with individual tabs extending from each layer. This segmentation allows the current to be distributed across multiple parallel paths through the vertical stack, reducing the effective current path length and self-inductance while providing multiple termination points for low-inductance connections.
4Reliability
If multiple terminations are implemented to reduce inductance, then equivalent series inductance decreases, but device complexity increases
Solution Approach 1:
The patent merges multiple capacitor functions and termination points into a single vertically integrated component. Instead of requiring multiple separate capacitors with individual terminations, the vertical stack provides multiple electrode tabs and connection points within one component body, reducing device complexity while achieving low inductance through multiple parallel current paths.
Solution Approach 2:
The patent creates a universal component structure where the vertical stack can provide multiple capacitance values, multiple termination points, and transient suppression functionality all in one device. This multi-functionality reduces the need for multiple separate components and complex interconnections, simplifying the overall device while maintaining low equivalent series inductance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables closer component spacing, reduced parasitic capacitance, and enhanced filtering capabilities with adjustable inductance, resistance, and capacitance values, supporting high-frequency operations and transient voltage suppression.
Implementation Method 1
encasing material that can be dielectric or varistor material, allowing for configurable electrical characteristics and transient overvoltage suppression
Implementation Method 2
A multilayer vertically integrated array with interdigitated electrode configurations and a land grid array packaging configuration, featuring electrode layers with exposed tabs for termination
Implementation Method 3
encasing material that can be dielectric or varistor material
Data Source
AI summary
The present subject matter is directed to methods and apparatus for providing a multilayer array component with interdigitated electrode layer portions configured to selectively provide signal filtering characteristics, over-voltage transient suppression capabilities, and land grid array (LGA) terminations. Embodiments of the present subject matter may define a single capacitor, a capacitor array, or a multilayer vertically integrated array with configurable equivalent electrical characteristics including equivalent series inductance (ESL), equivalent series resistance (ESR), and configurable capacitance and voltage clamping and transient suppression capabilities.