Multilayer Band Elimination Filter Using Segmented Inductor
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Solution Overview
Problem
The challenge in fabricating band elimination filters with stopbands in quasi-millimeter or millimeter wave bands using multilayer stacks is the difficulty in precision fabrication of spiral-shaped inductors, leading to variations in filter characteristics.
Innovation Solution
The implementation of a multilayer electronic component with a band elimination filter that includes a connection path with an impedance transformer, featuring a distributed constant line and a through hole line section, allowing for precise fabrication and reduced characteristic variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a spiral-shaped inductor with extremely small length is used to implement a band elimination filter in quasi-millimeter or millimeter wave band, then the filter can achieve the desired frequency characteristics, but the inductor becomes extremely difficult to fabricate with high precision using a multilayer stack
Solution Approach 1:
The inductor is divided into multiple short conductor line sections that are stacked vertically in different layers of the multilayer structure. Each section contributes to the total inductance, and the segmented approach allows each individual section to be fabricated with standard precision while achieving the required total inductance value through their combined effect.
Solution Approach 2:
The inductor design transitions from a planar spiral configuration to a three-dimensional stacked configuration utilizing the vertical dimension of the multilayer structure. This dimensional change allows the inductor to achieve the required electrical characteristics without requiring extremely small planar dimensions that are difficult to fabricate.
2Adaptability or versatility
If a spiral-shaped inductor is used in the band elimination filter, then the filter can provide stopband in quasi-millimeter or millimeter wave band, but the inductor shape and characteristic vary greatly when actually fabricated
Solution Approach 1:
By segmenting the inductor into multiple standardized conductor line sections distributed across different layers, the design achieves the required frequency band coverage while each individual section maintains stable and consistent geometric characteristics that are easy to fabricate with high precision.
Solution Approach 2:
The inductor design changes from a single-planar spiral with fixed geometric parameters to a multi-layer stacked structure where the total inductance is achieved through the combination of multiple sections. This parameter change allows each section to have stable, standardized dimensions while the overall inductor achieves the required electrical characteristics.
3Ease of manufacture
If a conventional LC circuit with spiral inductor is used, then the band elimination filter can be implemented, but it is difficult to fabricate the filter to provide desired characteristics due to inductor variations
Solution Approach 1:
The inductor is segmented into multiple conductor line sections that can be fabricated using standard multilayer printing and etching processes. Each section has dimensions that are within standard fabrication capabilities, making the overall filter easier to manufacture with high precision compared to a single small spiral inductor.
Solution Approach 2:
The inductor design utilizes the vertical stacking dimension of the multilayer structure rather than relying on miniaturization in the planar dimension. This dimensional transition enables fabrication using conventional multilayer manufacturing processes while achieving the required electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the easy implementation of band elimination filters with consistent characteristics in quasi-millimeter or millimeter wave bands, improving precision and reducing variations in filter performance.
Implementation Method 1
The through hole line section includes at least one through hole provided in the multilayer stack. Each of the first and second conductor lines is formed of at least one of the plurality of conductor layers.
Data Source
AI summary
A multilayer electronic component includes a multilayer stack, and a band elimination filter formed using the multilayer stack. The band elimination filter includes a first input/output end, a second input/output end, a connection path connecting the first and second input/output ends, and a resonator coupled to the connection path. The connection path includes an impedance transformer. The resonator includes a first conductor line constituting a first distributed constant line. The impedance transformer includes a second conductor line constituting a second distributed constant line, and a through hole line section connected in series to the second conductor line.