Multilayer Blister Packaging for Moisture-Protected Lyophilized Tablets

The patent employs a multilayer blister packaging structure comprising a base layer, intermediate layer, and lid layer, where each layer serves specific protective functions. The base layer provides structural support, the intermediate layer offers moisture and oxygen barrier properties, and the lid layer ensures hermetic sealing. This composite structure effectively prevents moisture and oxygen transmission that would otherwise damage the tablet's disintegrating ability, while maintaining manufacturability through standardized lamination processes.

The multilayer packaging structure includes light-blocking layers with opaque and metallized coatings integrated into the base, intermediate, and lid layers. These light-blocking layers prevent light exposure that would otherwise damage active therapeutic ingredients such as nicotine or cannabidiol, thereby maintaining drug efficacy. The light protection is achieved through material selection and layer configuration rather than adding separate components, keeping the manufacturing process relatively simple.

The packaging structure applies different material properties to different layers: the base layer uses materials with good heat transfer properties to facilitate heat transfer during freezing and lyophilization processes, while the intermediate and lid layers incorporate opaque and metallized materials that provide light shielding and moisture barrier functions. This local differentiation of material qualities allows simultaneous achievement of thermal performance during manufacturing and protective performance during storage.

The multilayer structure combines materials with complementary properties: the base layer incorporates materials optimized for heat transfer to improve lyophilization efficiency, while the intermediate and lid layers provide structural reinforcement through metallized and opaque materials. The lamination process creates strong interlayer bonds that maintain overall packaging integrity even when the base layer is optimized for thermal performance. This composite approach allows the packaging to meet both processing and storage requirements.