Multilayer Circuit Board Layout for Heat Balance and Buckling Control
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Solution Overview
Problem
Conventional motor driving circuit boards experience thermal asymmetry and buckling due to biased conductor layer arrangement, leading to reduced heat-radiating characteristics and increased risk of circuit board failure.
Innovation Solution
A circuit board design with symmetrical conductor layer thickness and arrangement, featuring identical thicknesses for outer conductor layers and inner layers nearest to the board surfaces, and the use of heatsinks on both sides to balance thermal distribution and reduce asymmetry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a plurality of analog-to-digital converters are used to increase A/D conversion capacity, then the A/D conversion capacity is improved, but the number of components and circuit complexity increase
Solution Approach 1:
The patent combines multiple A/D conversion functions into a single integrated A/D conversion unit that can sequentially serve multiple sensors. This unit includes a single analog-to-digital converter that time-multiplexes among temperature sensor, acceleration sensor, and other sensors, thereby reducing the number of separate converter components while maintaining the capability to convert signals from all sensors.
Solution Approach 2:
The A/D conversion unit is designed with multi-functionality to handle different sensor types. It includes a temperature sensor A/D conversion unit and an acceleration sensor A/D conversion unit within the same integrated structure, allowing a single component to perform multiple conversion functions that would otherwise require separate dedicated converters for each sensor type.
2Measurement precision
If sampling periods are set individually for each sensor to optimize performance, then measurement precision is improved, but the control device complexity increases
Solution Approach 1:
The control device implements dynamic sampling period adjustment where the sampling period is automatically changed based on the operating state. The sampling period is set to a first value during normal operation and a second value (different from the first) during abnormal states, allowing the system to adapt sampling rates dynamically without requiring complex individual control for each sensor.
Solution Approach 2:
The system changes the sampling period parameter based on detected abnormal states. When an abnormal state is detected (such as collision or falling), the sampling period is switched between different values to increase measurement precision for the specific condition, thereby achieving precise measurement without permanently configuring complex individual sampling controls for all sensors.
3Speed
If the A/D conversion unit operates at high capacity continuously, then conversion speed is improved, but power consumption increases
Solution Approach 1:
The A/D conversion unit operates periodically rather than continuously, with sampling performed at specific intervals based on the sampling period. During normal operation, sampling occurs at a standard rate, and during abnormal states, the sampling period changes to increase the frequency of conversions temporarily, thereby achieving high conversion speed only when needed rather than maintaining it continuously, which reduces overall power consumption.
Data Source
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AI summary
The present invention provides an electronic controlling apparatus that can improve heat-radiating characteristics, and that can also suppress occurrences of buckling of a multilayered circuit board. An electronic controlling apparatus according to the present invention includes: a circuit board in which conductor layers and insulating layers are disposed alternately; a power circuit that includes a plurality of power elements that are each mounted to the circuit board so as to be connected to an upper portion wiring pattern that is formed by an upper portion outer conductor layer that is disposed on a first surface of the circuit board among the conductor layers; and a control portion that is mounted to the circuit board so as to be connected to a lower portion wiring pattern that is formed by a lower portion outer conductor layer that is disposed on a second surface of the circuit board among the conductor layers, thicknesses of the upper portion outer conductor layer and the lower portion outer conductor layer are identical and have greatest thickness among the conductor layers, or thicknesses of a first outermost position inner conductor layer and a second outermost position inner conductor layer that are positioned at two end portions inside the circuit board are identical and have greatest thickness among the conductor layers, and the conductor layers are disposed symmetrically so as to have a central plane in a thickness direction of the circuit board as a plane of symmetry.