Multilayer Circuit Board Bonding With Fluid-Mediated Pressure
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Solution Overview
Problem
Existing multilayer circuit board manufacturing methods using a roll-to-roll process face challenges in applying uniform pressure and temperature, leading to potential defects in product quality due to non-uniform pressure distribution during the bonding of composite materials.
Innovation Solution
A multilayer circuit board manufacturing apparatus and method that utilizes a compressing machine with a belt and non-contact pressing devices, employing high-temperature and high-pressure fluids to uniformly press the materials, followed by a curing process to ensure consistent bonding and minimize defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a roll-to-roll stacking method is used to manufacture multilayer circuit boards, then the manufacturing process can be automated and continuous, but non-uniform pressure distribution occurs during bonding which causes appearance defects and reduces product quality
Solution Approach 1:
A belt is introduced as an intermediary element between the pressing device and the composite materials. The belt rotates and contacts one surface of the materials, transferring pressure uniformly across the entire surface. This mediator ensures even pressure distribution while allowing continuous roll-to-roll processing, thereby resolving the contradiction between automated continuous manufacturing and pressure uniformity.
Solution Approach 2:
The traditional direct mechanical pressing system is replaced with a fluid pressing system. A fluid pressing device supplies fluid under pressure to the belt, which then transmits the pressure to the composite materials. This substitution of mechanical direct contact with fluid-mediated pressure transmission achieves more uniform pressure distribution while maintaining continuous processing capability.
2Strength
If pressure is applied directly to composite materials during bonding, then bonding can be achieved, but non-uniform pressure causes poor appearance and quality defects
Solution Approach 1:
The belt serves as a mediator that distributes pressure uniformly across the composite materials. Instead of direct pressure application that creates localized stress points and appearance defects, the rotating belt evenly spreads the bonding pressure, ensuring both strong bonding and high appearance quality.
Solution Approach 2:
The system changes the pressure application parameters by introducing a rotating belt that dynamically distributes pressure. The fluid pressing device controls the pressure magnitude while the belt's rotation and contact mechanics ensure uniform spatial distribution, transforming the pressure application from a problematic direct method to an optimized indirect method that achieves both bonding strength and appearance quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of high-quality multilayer circuit boards with reduced appearance defects and improved product quality by maintaining uniform pressure and temperature across the entire surface during the manufacturing process.
Implementation Method 1
a fluid pressing unit configured to supply a fluid toward the belt
Implementation Method 2
a heating section which is located in the oven and provides heat to the multilayer circuit board
Data Source
AI summary
Disclosed are a multilayer circuit board manufacturing apparatus and a multilayer circuit board manufacturing method. The present disclosure includes: a plurality of uncoilers configured to supply a plurality of different members; and a compressing machine configured to bond the members, which are supplied from the respective uncoilers, to each other. The compressing machine includes: a belt that rotates in contact with one surface of one of the plurality of members; and a pressing device which is located inside the belt and spaced apart from the belt, and presses the belt toward the member in a non-contact manner.