Multilayer Board Layout for Uniform LED Mounting and Heat Dissipation
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Solution Overview
Problem
Multilayer board structures with flexible substrates face issues such as thickness variations leading to open-circuit states, tilting of LEDs, inefficient heat dissipation, and short-circuit risks due to uneven thickness distribution and non-uniform heat transfer, which affect the performance and reliability of flexible display devices.
Innovation Solution
A multilayer board structure with uniform metal layer distribution beneath electrodes, using stacked substrates and metal patterns to ensure consistent thickness and efficient heat dissipation, preventing tilting and ensuring reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal layers are unevenly distributed in the multilayer board structure, then heat dissipation efficiency improves for certain regions, but thickness uniformity deteriorates causing open-circuit states and LED tilting
Solution Approach 1:
The patent applies local quality by configuring metal layers with different numbers and arrangements in different regions of the board. Specifically, regions with higher heat generation (such as areas with multiple LED electrodes) have more metal layers for enhanced heat dissipation, while other regions have fewer layers. This localized differentiation allows optimal heat management without compromising overall thickness uniformity, as each region's metal layer configuration is tailored to its specific thermal and electrical requirements.
Solution Approach 2:
The patent segments the multilayer board structure into multiple substrate layers, each with independently controllable metal layer configurations. By dividing the board into stacked substrates, the invention can manage heat dissipation and thickness control at each layer level separately, allowing flexible customization of metal layer distribution without creating uniform thickness variations across the entire board structure.
2Temperature
If the number of metal layers varies beneath different electrodes, then heat dissipation is optimized for high-heat regions, but electrical connection reliability deteriorates due to thickness variations
Solution Approach 1:
The patent implements local quality by differentiating metal layer configurations based on the specific requirements of each electrode region. High-heat generation areas (such as regions with cathode electrodes) receive additional metal layers for enhanced heat dissipation, while regions with lower thermal demands maintain simpler metal layer structures. This localized approach allows heat dissipation optimization without compromising electrical connection reliability, as each region's configuration is optimized for its specific functional needs.
Solution Approach 2:
The patent applies parameter changes by varying the number, thickness, and arrangement of metal layers as configurable parameters in different regions of the multilayer board. This allows the metal layer structure to be adapted to local requirements, with regions experiencing higher temperatures receiving increased metal layer density for better heat dissipation, while other regions maintain parameters that ensure reliable electrical connections without unnecessary complexity.
3Manufacturing precision
If uniform metal layer distribution is implemented across all substrates, then thickness uniformity is maintained preventing LED tilting, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent resolves this contradiction by applying local quality through differentiated metal layer configurations in different regions. Instead of uniform distribution, the invention implements region-specific metal layer arrangements where high-heat-generation areas (such as regions with multiple LED electrodes or cathode connections) have increased metal layer density for enhanced heat dissipation, while other regions have fewer layers. This localized differentiation maintains thickness uniformity where needed while improving heat dissipation efficiency where required.
Solution Approach 2:
The patent segments the multilayer board into multiple substrate layers with independently configurable metal layers. This segmentation allows the invention to maintain uniform thickness in regions where it is critical (preventing LED tilting) while simultaneously implementing enhanced heat dissipation structures in high-heat regions. The stacked substrate architecture enables localized optimization without compromising overall structural integrity or causing widespread thickness variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform board thickness, reliable electrical connections, improved front luminance, and efficient heat dissipation, reducing implementation defects and enhancing the performance of flexible display devices.
Implementation Method 1
remaining substrates of the plurality of stacked substrates, other than the uppermost substrate, have surfaces formed with metal layers
Data Source
Figure 1A~1D
Figure 2A~2B
Figure 3A~3B
AI summary
A multilayer board structure includes a plurality of light emitting devices, each light emitting device of the plurality of light emitting devices having a plurality of electrodes formed on a terminal surface thereof, and a multilayer board including a plurality of stacked substrates and implemented with the plurality of light emitting devices. An uppermost substrate of the plurality of stacked substrates has a surface formed with metal layers coupling electrodes of the plurality of light emitting devices. Remaining substrates of the plurality of stacked substrates, other than the uppermost substrate, have surfaces formed with metal layers, respectively. A number of metal layers located directly below the electrodes of the plurality of light emitting devices is the same for each of the electrodes.