Multilayer Board Limiting Member for Flatness and Resistance Control
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Solution Overview
Problem
Existing methods for manufacturing multilayer boards, such as those described in PTL 2, face issues with substrate flatness and conductive layer uniformity due to load concentration during stacking, leading to potential extrusion of conductive paste and abnormal resistance values.
Innovation Solution
A multilayer board structure incorporating a limiting member with a through hole between substrates, fixed by adhesives on both surfaces, limits substrate distance and maintains flatness, ensuring uniform conductive layer thickness and preventing abnormal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If substrates are stacked by pressurizing and heating without a limiting member, then bonding strength between substrates is improved, but load concentrates on the raised center part causing conductive paste extrusion and abnormal resistance values
Solution Approach 1:
A limiting member is introduced as an intermediary component between the first and second substrates. This limiting member has a through hole that accommodates the terminal parts and restricts the distance between substrates, preventing excessive pressurization that would cause conductive paste extrusion while still allowing sufficient bonding to occur.
Solution Approach 2:
The limiting member controls the physical parameter of substrate distance/spacing, maintaining a predetermined gap between the first and second substrates. This parameter control prevents the substrates from pressing too closely together, thereby preventing conductive paste extrusion while maintaining adequate bonding conditions.
2Ease of operation
If fixation pins and manual assembly are used to connect multilayer wiring boards, then assembly flexibility is improved, but reliability of bonding surfaces becomes unstable and processing complexity increases
Solution Approach 1:
The patent replaces the mechanical fixation pin system with a pressurizing and heating system that uses thermal energy and controlled mechanical pressure. This substitution eliminates the need for fixation pins and manual assembly operations, providing more stable and reliable bonding surfaces through consistent thermal and pressure application.
Solution Approach 2:
The bonding process utilizes phase transitions of the conductive paste and adhesive materials through heating. The materials transition from a soft, formable state during pressurization to a cured, stable state after heating, creating reliable bonds without requiring fixation pins or manual intervention.
3Area of stationary object
If substrates are pressed together without distance control, then bonding area is increased, but flatness of the multilayer board deteriorates and conductive layer thickness becomes non-uniform
Solution Approach 1:
The limiting member serves as a mediator that maintains a predetermined distance between substrates, preventing excessive compression that would cause warping. This intermediary structure allows sufficient bonding area to be achieved while maintaining overall flatness of the multilayer board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform conductive layer thickness and prevents abnormal resistance values by maintaining substrate flatness and preventing conductive paste extrusion, enhancing bonding strength and reliability.
Implementation Method 1
the adhesive sheet and the conductive paste are thermally cured, whereby the first substrate and the second substrate are integrated into one body
Implementation Method 2
the adhesive sheet and the conductive paste are thermally cured
Implementation Method 3
The filler is made by plating solder that has a second melting point lower than a first melting point, on surfaces of metal particles having the first melting point
Data Source
AI summary
The present invention addresses the problem that, when applying pressure and heat to laminate substrates, to maintain the flatness of the substrates so as not to have the load concentrated in one part, and to prevent the occurrence of resistance value abnormalities by making the electrically conductive layers between terminal parts uniform over the entire substrate. As a solution, the present invention comprises: a first substrate (A); a first terminal part (28) formed on a first surface (1A) of the first substrate (A); a second substrate (B) positioned facing the first surface (1A) of the first substrate (A); a second terminal part (38) formed on a first surface (1B) that faces the first terminal part (28) in the second substrate (B); a restricting member (50) interposed between the first substrate (A) and the second substrate (B), the restricting member (50) restricting the gap between the first substrate (A) and the second substrate (B) and having formed therein a through hole (51) that communicates between the first terminal part (28) and the second terminal part (38); and an electrically conductive paste (46) that is positioned inside the through hole (51), and that electrically connects the first terminal part (28) and the second terminal part (38).