Multilayer Board Nonconductive Heat Sink Via for LED Thermal Management

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Solution Overview

Problem

Existing light-emitting modules face challenges in maintaining optical efficiency and electrical characteristics of LEDs due to heat management issues, leading to degradation over time.

Innovation Solution

A multilayer board with a nonconductive heat sink via and a thin copper layer structure is used to create a heat sink channel for LED chips, allowing for effective heat dissipation without electrical conduction, thereby preventing circuit closure and enhancing thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional heat sink structures are used, then heat dissipation is achieved, but electrical conduction causes circuit closure and reliability issues

Engineering Contradiction:

Improveheat dissipationVSAvoidcircuit closure prevention

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The heat sink via is segmented into multiple sections: a first section extending from the front surface to a first depth, a second section extending from the front surface to a second depth greater than the first depth, and a third section connecting the first and second sections. This segmentation allows the via to provide thermal conduction paths at different depths while maintaining electrical insulation, thereby preventing circuit closure while achieving effective heat dissipation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The nonconductive heat sink via acts as an intermediary structure between the LED chip and the heat sink. It provides a thermal conduction path while maintaining electrical insulation, effectively mediating between the need for heat dissipation and the need to prevent circuit closure. The via includes a nonconductive material that enables thermal transfer without electrical conduction.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Use of energy by moving object

If LED chips are mounted on light-emitting modules, then optical efficiency is achieved, but heat generation degrades electrical characteristics over time

Engineering Contradiction:

Improveoptical efficiencyVSAvoidelectrical characteristics stability

Core Design Contradiction:

Use of energy by moving objectVSReliability

Solution Approach 1:

The multilayer board structure with nonconductive heat sink vias is prepared in advance before LED chip mounting. The heat dissipation paths are pre-established through the board structure, allowing immediate and effective heat removal from the LED chips from the beginning of operation. This preliminary preparation prevents heat accumulation that would otherwise degrade electrical characteristics over time.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention converts the harmful heat generated by LED operation into a beneficial controlled thermal management system. The nonconductive heat sink vias capture and channel the heat away from the LED chips through dedicated thermal paths, transforming the harmful thermal byproduct into a controlled heat dissipation process that maintains electrical characteristics stability.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Temperature

If multilayer board structure is implemented, then heat management is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveheat managementVSAvoidmultilayer board structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The nonconductive heat sink via structure serves multiple functions simultaneously: it provides thermal conduction paths at different depths, maintains electrical insulation, prevents circuit closure, and supports mechanical bonding of the LED chip. This multi-functionality reduces the need for separate components and simplifies the overall system despite the multilayer structure.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The heat sink via structure employs a nested configuration where the third section connects and integrates the first and second sections. The first section, second section, and third section are nested within each other's spatial footprint, creating a compact hierarchical structure that maximizes thermal conduction capability while minimizing the horizontal space required, thereby reducing manufacturing complexity.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively dissipates heat generated by LED chips, maintaining optical efficiency and electrical characteristics, and preventing circuit closure, thus extending the lifespan of light-emitting modules.

Implementation Method 1

a nonconductive heat sink via contacts at least one of the electrode pattern and the second thin copper layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8823145B2Multilayer board and light-emitting module having the same

Publication Date: 2014.09.02 SUZHOU LEKIN SEMICON CO LTD

AI summary

Provided are a multilayer board and a light-emitting module having the same. The light-emitting module comprises a light-emitting diode chip and a multilayer board. The multilayer board is electrically connected to the light-emitting diode chip and comprises a nonconductive heat sink via and a thin copper layer.