Multilayer Board Raised Interface for Crack Reduction
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Solution Overview
Problem
Existing multilayer boards experience cracks and chips at regions where the number of laminated insulator layers changes, leading to potential structural failures.
Innovation Solution
A multilayer board design featuring a first board portion with laminated resin layers of a first material, a second board portion with laminated resin layers of a second material, and a raised portion of the first material covering part of the side of the second board portion, where the second board portion protrudes from the first board portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of laminated insulator layers changes to provide thick portion with electronic-component-like function, then the functional capability is improved, but stress concentration occurs at the interface leading to cracks and chips
Solution Approach 1:
The patent applies local quality by creating a raised portion at the interface between board portions with different numbers of insulator layers. This localized structural modification concentrates the transition zone, allowing the rest of the board to maintain uniform thickness while the raised portion manages the stress concentration at the interface where the number of layers changes.
Solution Approach 2:
The raised portion acts as a pre-designed cushioning structure that anticipates and mitigates stress concentration before it can cause cracks or chips. By protruding from the base surface, it creates a gradual transition zone that distributes mechanical stresses away from the sharp interface between board portions with different layer counts.
2Reliability
If a raised portion is added to cover the side of the protruding portion, then stress concentration is reduced, but manufacturing complexity increases
Solution Approach 1:
The raised portion is integrated with the protruding portion as a unified structure. The raised portion protrudes from the base surface of the protruding portion, merging the stress-relief function with the existing geometric feature. This integration avoids adding separate independent components, thereby limiting the increase in manufacturing complexity.
Data Source
AI summary
A multilayer board includes a first board portion, a second board portion, and a raised portion. The first board portion is composed of a first material. The second board portion is composed of a second material, is joined to the first board portion, and includes a protruding portion protruding from the first board portion. The raised portion is composed of the first material, is joined to a base portion of the protruding portion of the second board portion, is raised around the base portion of the protruding portion, and covers part of a side portion of the protruding portion.