Multilayer Circuit Board Connections for Low RF Signal Loss
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Solution Overview
Problem
As electronic components become smaller, their electrode pads decrease in size, leading to increased resistance and radio frequency signal loss in multilayer circuit devices.
Innovation Solution
A circuit board design featuring a multilayer body with signal electrodes and conductor layers connected by interlayer connection conductors that do not overlap mounting portions, reducing signal loss by optimizing electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electrode pads are reduced in size to accommodate smaller electronic components, then component density increases, but resistance increases and radio frequency signal loss increases
Solution Approach 1:
The patent introduces interlayer connection conductors that extend through insulator layers in the vertical direction, adding a third dimension to the electrical connection path. This allows signal transmission to utilize the vertical dimension rather than being constrained to horizontal plane, effectively bypassing the resistance issue caused by reduced electrode pad sizes while maintaining high component density
Solution Approach 2:
The electrical connection path is segmented into multiple sections: signal electrodes on the upper surface, interlayer connection conductors through insulator layers, and signal conductor layers on the lower surface. This segmentation allows each component to be optimized independently - small electrode pads for high density, and optimized conductor paths for low resistance - resolving the contradiction between component size and signal loss
2Reliability
If interlayer connection conductors are positioned to connect signal electrodes and conductor layers, then electrical connection is achieved, but mounting portions may be obscured or deformed
Solution Approach 1:
The patent applies different spatial arrangements to different regions: interlayer connection conductors are positioned at locations that do not overlap with mounting portions when viewed in the vertical direction. This local differentiation ensures that electrical connection reliability is maintained through proper conductor placement while component mounting areas remain accessible and undeformed
Data Source
AI summary
A multilayer body includes insulator layers including a first insulator layer laminated in a vertical direction. Electrodes include a signal electrode and are provided at an upper main surface of the first insulator layer and arranged in a transverse direction. At least a portion of each of the electrodes is exposed to outside from a circuit board. First and second interlayer connection conductors extend through the first insulator layer in the vertical direction and electrically connect the signal electrode and a signal conductor layer. Mounting portions are located at the portions of the electrodes that are exposed to the outside from the circuit board. The first and second interlayer connection conductors are electrically connected to the signal electrode so as not to overlap the mounting portion that is provided at the signal electrode.